Datasheet

TMC6200 DATASHEET (Rev. 1.04 / 2019-AUG-08) 40
www.trinamic.com
Digital pins
DC-Characteristics
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Input voltage low level
V
INLO
-0.3
0.3 V
VIO
V
Input voltage high level
V
INHI
0.7 V
VIO
V
VIO
+0.3
V
Input Schmitt trigger hysteresis
V
INHYST
0.12
V
VIO
V
Output voltage low level
V
OUTLO
I
OUTLO
= 2mA
0.2
V
Output voltage high level
V
OUTHI
I
OUTHI
= -2mA
V
VIO
-0.2
V
Input leakage current
I
ILEAK
-10
10
µA
Pullup / pull-down resistors
R
PU
/R
PD
132
166
200
kΩ
Digital pin capacitance
C
3.5
pF
11.3 Thermal Characteristics
The following table shall give an idea on the thermal resistance of the package. The thermal
resistance for a four-layer board will provide a good idea on a typical application. Actual thermal
characteristics will depend on the PCB layout, PCB type and PCB size. The thermal resistance will
benefit from thicker CU (inner) layers for spreading heat horizontally within the PCB. Also, air flow will
reduce thermal resistance.
Parameter
Symbol
Conditions
Typ
Unit
Typical power dissipation
P
D
20kHz chopper, 24V supply, internal
supply regulators
<0.5
W
Thermal resistance junction to
ambient on a multilayer board
R
TMJA
Dual signal and two internal power
plane board (2s2p) as defined in
JEDEC EIA JESD51-5 and JESD51-7
(FR4, 35µm CU, 70mm x 133mm,
d=1.5mm)
21
K/W
Thermal resistance junction to
board
R
TJB
PCB temperature measured within
1mm distance to the package leads
8
K/W
Thermal resistance junction to
case
R
TJC
Junction temperature to heat slug of
package
3
K/W
Table 11.1 Thermal characteristics TQFP48-EP
The thermal resistance in an actual layout can be tested by checking for the heat up caused by the
standby power consumption of the chip. When no motor is attached, all power seen on the power
supply is dissipated within the chip.