Datasheet

TMC5160 DATASHEET (Rev. 1.01 / 2017-NOV-29) 14
www.trinamic.com
Pin
TQFP
QFN
Type
Function
HA2
36
36
High side gate driver output.
BMA2
37
37
Bridge Center and bootstrap capacitor negative connection.
LA2
38
38
Low side gate driver output.
LA1
39
39
Low side gate driver output.
BMA1
40
40
Bridge Center and bootstrap capacitor negative connection.
HA1
41
41
High side gate driver output.
CA1
42
42
Bootstrap capacitor positive connection.
CB2
43
43
Bootstrap capacitor positive connection.
HB2
44
44
High side gate driver output.
BMB2
45
45
Bridge Center and bootstrap capacitor negative connection.
LB2
46
46
Low side gate driver output.
LB1
47
47
Low side gate driver output.
BMB1
48
1
Bridge Center and bootstrap capacitor negative connection.
Exposed die
pad
-
-
Connect the exposed die pad to a GND plane. Provide as many
as possible vias for heat transfer to GND plane. Serves as GND
pin for the low side gate drivers. Ensure low loop inductivity
to sense resistor GND.
*(pd) denominates a pin with pulldown resistor
* All digital pins DI, DIO and DO use VCC_IO level and contain protection diodes to GND and VCC_IO
* All digital inputs DI and DIO have internal Schmitt-Triggers