Datasheet

TMC5160 DATASHEET (Rev. 1.01 / 2017-NOV-29) 124
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29 Layout Considerations
29.1 Exposed Die Pad
The TMC5160 uses its die attach pad to dissipate heat from the gate drivers and the linear regulator to
the board. For best electrical and thermal performance, use a reasonable amount of solid, thermally
conducting vias between the die attach pad and the ground plane. The printed circuit board should
have a solid ground plane spreading heat into the board and providing for a stable GND reference.
29.2 Wiring GND
All signals of the TMC5160 are referenced to their respective GND. Directly connect all GND pins under
the device to a common ground area (GND, GNDP, GNDA and die attach pad). The GND plane right
below the die attach pad should be treated as a virtual star point. For thermal reasons, the PCB top
layer shall be connected to a large PCB GND plane spreading heat within the PCB.
Attention
Place the TMC5160 near to the MOSFET bridge and sense resistor GND in order to avoid ringing
leading to GND differences and to dangerous inductive peak voltages.
29.3 Supply Filtering
The 5VOUT output voltage ceramic filtering capacitor (2.2 to 4.7 µF recommended) should be placed as
close as possible to the 5VOUT pin, with its GND return going directly to the GNDA pin. This ground
connection shall not be shared with other loads or additional vias to the GND plan. Use as short and
as thick connections as possible. For best microstepping performance and lowest chopper noise an
additional filtering capacitor should be used for the VCC pin to GND, to avoid digital part ripple
influencing motor current regulation. Therefore place a ceramic filtering capacitor (470nF
recommended) as close as possible (1-2mm distance) to the VCC pin with GND return going to the
ground plane. VCC can be coupled to 5VOUT using a 2.2 Ω or 3.3 Ω resistor in order to supply the
digital logic from 5VOUT while keeping ripple away from this pin. A 100 nF filtering capacitor should
be placed as close as possible to the VSA pin to ground plane.
Please carefully read chapters 3.3 and 3.4 to understand the special considerations with regard to
layout and component selection for the external MOSFET power bridges.