Datasheet

TMC5160 DATASHEET (Rev. 1.01 / 2017-NOV-29) 123
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Parameter
Symbol
Conditions
Typ
Unit
Typical power dissipation
P
D
stealthChop or spreadCycle, 40 or
20kHz chopper, 24V, internal supply
regulators
0.6
W
Thermal resistance junction to
ambient on a multilayer board
R
TMJA
Dual signal and two internal power
plane board (2s2p) as defined in
JEDEC EIA JESD51-5 and JESD51-7
(FR4, 35µm CU, 70mm x 133mm,
d=1.5mm)
21
K/W
Thermal resistance junction to
board
R
TJB
PCB temperature measured within
1mm distance to the package leads
8
K/W
Thermal resistance junction to
case
R
TJC
Junction temperature to heat slug of
package
3
K/W
Table 28.1 Thermal characteristics TQFP48-EP
The thermal resistance in an actual layout can be tested by checking for the heat up caused by the
standby power consumption of the chip. When no motor is attached, all power seen on the power
supply is dissipated within the chip.