Datasheet

TMC262 / TMC262C DATASHEET (Rev. 2.22 / 2019-FEB-22) 6
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2 Pin Assignments
2.1 Package Outline
GND
HA1
HA2
BMA2
BMA1
SRA
VCC_IO VS
CSN
GND
SDI
SCK
SRB
LB2
LB1
BMB1
BMB2
HB2
HB1
VHS
CLK
Top view
LA1
LA2
32 31 30 29 28 27 26 25
9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24
1 2 3 4 5 6 7 8
TMC 262-LA
ENN
SDO
5VOUT
TST_ANA SG_TST GNDP DIR STEP TST_MODE
Figure 2.1 TMC262 pin assignments
2.2 Signal Descriptions
Pin
Number
Type
Function
GND, GNDP,
exposed
pad
1
GND pads for different parts of the internal circuitry. Tie all GND
pins and the die attach pad to a solid common GND plane. Directly
connect the sense resistor GND side to this GND plane.
13
28
HA1
2
O (VS)
High side P-channel driver output. Becomes driven to VHS to switch
on MOSFET.
HA2
3
HB1
23
HB2
22
BMA1
5
I (VS)
Sensing input for bridge outputs. Used for short to GND protection.
May be tied to VS if unused.
BMA2
4
BMB1
20
BMB2
21
LA1
6
O 5V
Low side MOSFET driver output. Becomes driven to 5VOUT to switch
on MOSFET.
LA2
7
LB1
19
LB2
18
SRA
8
AI
Sense resistor input of chopper driver.
SRB
17