Datasheet

TMC262 / TMC262C DATASHEET (Rev. 2.22 / 2019-FEB-22) 59
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19 Package Mechanical Data
19.1 Dimensional Drawings
Attention: Drawings not to scale.
Parameter
Ref
Min
Nom
Max
Total thickness
A
0.80
0.85
0.90
Standoff
A1
0.00
0.035
0.05
Mold thickness
A2
-
0.65
0.67
Lead frame thickness
A3
0.203
Lead width
b
0.2
0.25
0.3
Body size X
D
5.0
Body size Y
E
5.0
Lead pitch
e
0.5
Exposed die pad size X
J
3.2
3.3
3.4
Exposed die pad size Y
K
3.2
3.3
3.4
Lead length
L
0.35
0.4
0.45
Package edge tolerance
aaa
0.1
Mold flatness
bbb
0.1
Coplanarity
ccc
0.08
Lead offset
ddd
0.1
Exposed pad offset
eee
0.1
19.2 Package Code
Device
Package
Temperature range
Code/ Marking
TMC262
QFN32 (RoHS)
-40° to +125°C
TMC262-LA
TMC262C
QFN32 (RoHS)
-40° to +125°C
TMC262C-LA
Figure 19.1 Dimensional drawings