Datasheet

TMC262 DATASHEET (Rev. 2.14 / 2016-JUL-14) 6
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2 Pin Assignments
2.1 Package Outline
GND
HA1
HA2
BMA2
BMA1
SRA
VCC_IO
VS
CSN
GND
SDI
SCK
SRB
LB2
LB1
BMB1
BMB2
HB2
HB1
VHS
CLK
Top view
LA1
LA2
32 31 30 29 28 27 26 25
9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24
1 2 3 4 5 6 7 8
TMC 262-LA
ENN
SDO
5VOUT
TST_ANA
SG_TST
GNDP
DIR
STEP
TST_MODE
Figure 2.1 TMC262 pin assignments
2.2 Signal Descriptions
Pin
Number
Type
Function
GND
1
Digital and analog low power GND
13
HA1
2
O (VS)
High side P-channel driver output. Becomes driven to VHS to switch
on MOSFET.
HA2
3
HB1
23
HB2
22
BMA1
5
I (VS)
Sensing input for bridge outputs. Used for short to GND protection.
May be tied to VS if unused.
BMA2
4
BMB1
20
BMB2
21
LA1
6
O 5V
Low side MOSFET driver output. Becomes driven to 5VOUT to switch
on MOSFET.
LA2
7
LB1
19
LB2
18
SRA
8
AI
Sense resistor input of chopper driver.
SRB
17
5VOUT
9
Output of internal 5V linear regulator. This voltage is used to
supply the low side drivers and internal analog circuitry. An
external capacitor to GND close to the pin is required. Place the
capacitor near to pin 9 and pin 13. 470nF ceramic are sufficient for
most applications, an additional tantalum capacitor (10µF or more)
improves performance with high gate charge MOSFETs.
SDO
10
DO VIO
Data output of SPI interface (Tristate)