Datasheet

TMC2590 DATASHEET (V1.0 / 2019-FEB-22) 61
www.trinamic.com
Parameter
Ref
Min
Nom
Max
Body size Y
E1
5.0
Lead pitch
e
0.5
L
0.45
0.6
0.75
Footprint
L1
1 REF

0°
3.5°
7°
1
0°
2
11°
12°
13°
3
11°
12°
13°
R1
0.08
R2
0.08
0.2
S
0.2
Exposed die pad size X
M
2.68
2.78
2.88
Exposed die pad size Y
N
2.68
2.78
2.88
P
0.99
1.04
1.09
Q
1.19
1.24
1.29
T
0.05
0.15
U
0.35
0.45
V
0.45
0.55
Package edge tolerance
aaa
0.2
Lead edge tolerance
bbb
0.2
Coplanarity
ccc
0.08
Lead offset
ddd
0.08
Mold flatness
eee
0.05
19.2 Package Code
Device
Package
Temperature range
Code/ Marking
TMC2590
TQFP32-EP (RoHS)
-40° to +125°C
TMC2590-TA