Datasheet

TMC2300 DATASHEET (Rev. 1.02 / 2019-NOV-06) 67
www.trinamic.com
Parameter [mm]
Ref
Min
Nom
Max
total thickness
A
0.8
0.85
0.9
stand off
A1
0
0.035
0.05
mold thickness
A2
0.65
0.67
lead frame thickness
A3
0.203
Lead width
b
0.15
0.2
0.25
body size X
D
3.0
body size Y
E
3.0
lead pitch
e
0.4
exposed die pad size X
J
1.6
1.7
1.8
exposed die pad size Y
K
1.6
1.7
1.8
lead length
L
0.35
0.4
0.45
package edge tolerance
aaa
0.1
mold flatness
bbb
0.1
coplanarity
ccc
0.08
lead offset
ddd
0.1
exposed pad offset
eee
0.1
21.2 Package Codes
Type
Package
Temperature range
Code & marking
TMC2300-LA
QFN20 (RoHS)
-40°C ... +125°C
(TMC logo) 2300
22 Designed for Sustainability
Sustainable growth is one of the most important and urgent challenges today. We at Trinamic try to
contribute by designing highly efficient IC products, to minimize energy consumption, ensure best
customer experience and long-term satisfaction by smooth and silent run, while minimizing the
demand for external resources, e.g. for power supply, cooling infrastructure, reduced motor size and
magnet material by intelligent control interfaces and advanced algorithms.
Please help and design efficient and durable products made for a sustainable world.