Datasheet

TMC2300 DATASHEET (Rev. 1.02 / 2019-NOV-06) 63
www.trinamic.com
19.3 Thermal Characteristics
The following table shall give an idea on the thermal resistance of the package. The thermal
resistance for a four-layer board will provide a good idea on a typical application. Actual thermal
characteristics will depend on the PCB layout, PCB type and PCB size. The thermal resistance will
benefit from thicker CU (inner) layers for spreading heat horizontally within the PCB. Also, air flow will
reduce thermal resistance.
A thermal resistance of 40K/W for a typical board means, that the package is capable of continuously
dissipating 1W at an ambient temperature of 85°C with the die temperature staying below/at 125°C.
Note, that a thermally optimized layout is required.
Parameter
Symbol
Conditions
Typ
Unit
Typical power dissipation
P
D
StealthChop, 1A RMS in two phase
motor, sinewave, 35kHz chopper, 11V,
60°C peak surface of package (motor
QSH4218-035-10-027)
1
W
Typical power dissipation
P
D
StealthChop, 0.7A RMS in two phase
motor, sinewave, 35kHz chopper, 11V,
45°C peak surface of package (motor
QSH4218-035-10-027)
0.5
W
Thermal resistance junction to
ambient on a multilayer board
R
TMJA
Dual signal and two internal power
plane board (2s2p) as defined in
JEDEC EIA JESD51-5 and JESD51-7
(FR4, 35µm CU, 70mm x 133mm,
d=1.5mm)
40
K/W
Thermal resistance junction to
case
R
TJC
Junction to heat slug of package
7
K/W
Table 19.1 Thermal characteristics
Note
A spread-sheet for calculating power dissipation is available on www.trinamic.com.