Datasheet

48 TMC223 DATASHEET (V. 1.00 / May 3rd, 2007)
Copyright © 2007 TRINAMIC Motion Control GmbH & Co. KG
10 Package Thermal Resistance
10.1 SOIC-20 Package
The junction case thermal resistance is 28°C/W, leading to a junction ambient thermal resistance of
63°C/W, with the PCB ground plane layout condition given in the figure below and with
• PCB thickness = 1.6mm
• 1 layer
• Copper thickness = 35µm
2
×
(10mm
×
23mm)
Figure 27: Layout consideration