Datasheet

TMC222 DATASHEET (V. 1.11 / November 25, 2009) 43
Copyright © 2004-2007 TRINAMIC Motion Control GmbH & Co. KG
9 Package Thermal Resistance
9.1 SOIC-20 Package
The junction case thermal resistance is 28°C/W, leading to a junction ambient thermal resistance of
63°C/W, with the PCB ground plane layout condition given in the figure below and with
• PCB thickness = 1.6mm
• 1 layer
• Copper thickness = 35µm
2 (10mm 23mm)
Figure 27: Layout consideration