Datasheet

TMC2209 DATASHEET (Rev. 1.03 / 2019-JUN-26) 81
www.trinamic.com
Parameter [mm]
Ref
Min
Nom
Max
total thickness
A
0.8
0.85
0.9
stand off
A1
0
0.035
0.05
mold thickness
A2
0.65
lead frame thickness
A3
0.203
lead width
b
0.2
0.25
0.3
body size X
D
5.0
body size Y
E
5.0
lead pitch
e
0.5
exposed die pad size X *)
J
3.6
3.7
3.8
exposed die pad size Y *)
K
3.6
3.7
3.8
lead length *)
L
0.35
0.4
0.45
package edge tolerance
aaa
0.1
mold flatness
bbb
0.1
coplanarity
ccc
0.08
lead offset
ddd
0.1
exposed pad offset
eee
0.1
*) Attention: These parameters differ to TMC2208 package!
The TMC2209 has a bigger heat-slug than the TMC2208 for better power dissipation. Pad length is
slightly shorter to match this.
22.2 Package Codes
Type
Package
Temperature range
Code & marking
TMC2209-LA
QFN28 (RoHS)
-40°C ... +125°C
TMC2209-LA
TMC… -T
-T suffix denotes tape on reel packed products