Datasheet

TMC2160 DATASHEET (Rev. 1.00 / 2018-JUL-30) 13
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Pin
TQFP
Type
Function
VCC
29
5V supply input for digital circuitry within chip. Provide 100nF
or bigger capacitor to GND (GND plane) near pin. Shall be
supplied by 5VOUT. A 2.2 or 3.3 Ohm resistor is recommended
for decoupling noise from 5VOUT. When using an external
supply, make sure, that VCC comes up before or in parallel to
5VOUT or VCC_IO, whichever comes up later!
CPO
31
Charge pump capacitor output.
CPI
32
Charge pump capacitor input. Tie to CPO using 22nF 100V
capacitor.
VS
33
Motor supply voltage. Provide filtering capacity near pin with
short loop to GND plane. Must be tied to the positive bridge
supply voltage.
VCP
34
Charge pump voltage. Tie to VS using 100nF capacitor.
CA2
35
Bootstrap capacitor positive connection.
HA2
36
High side gate driver output.
BMA2
37
Bridge Center and bootstrap capacitor negative connection.
LA2
38
Low side gate driver output.
LA1
39
Low side gate driver output.
BMA1
40
Bridge Center and bootstrap capacitor negative connection.
HA1
41
High side gate driver output.
CA1
42
Bootstrap capacitor positive connection.
CB2
43
Bootstrap capacitor positive connection.
HB2
44
High side gate driver output.
BMB2
45
Bridge Center and bootstrap capacitor negative connection.
LB2
46
Low side gate driver output.
LB1
47
Low side gate driver output.
BMB1
48
Bridge Center and bootstrap capacitor negative connection.
Exposed die pad
-
Connect the exposed die pad to a GND plane. Provide as many
as possible vias for heat transfer to GND plane. Serves as GND
pin for the low side gate drivers. Ensure low loop inductivity
to sense resistor GND.
*(pd) denominates a pin with pulldown resistor
* All digital pins DI, DIO and DO use VCC_IO level and contain protection diodes to GND and VCC_IO
* All digital inputs DI and DIO have internal Schmitt-Triggers