Datasheet

TMC2130 DATASHEET (Rev. 1.09 / 2017-MAY-15) 100
www.trinamic.com
Parameter
Ref
Min
Nom
Max
total thickness
A
-
-
1.2
stand off
A1
0.05
-
0.15
mold thickness
A2
0.95
1
1.05
lead width (plating)
b
0.17
0.22
0.27
lead width
b1
0.17
0.2
0.23
lead frame thickness
(plating)
c
0.09
-
0.2
lead frame thickness
c1
0.09
-
0.16
body size X (over pins)
D
9.0
body size Y (over pins)
E
9.0
body size X
D1
7.0
body size Y
E1
7.0
lead pitch
e
0.5
lead
L
0.45
0.6
0.75
footprint
L1
1 REF

0°
3.5°
7°
1
0°
-
-
2
11°
12°
13°
3
11°
12°
13°
R1
0.08
-
-
R2
0.08
-
0.2
S
0.2
-
-
exposed die pad size X
M
4.9
5
5.1
exposed die pad size Y
N
4.9
5
5.1
package edge tolerance
aaa
0.2
lead edge tolerance
bbb
0.2
coplanarity
ccc
0.08
lead offset
ddd
0.08
mold flatness
eee
0.05
30.3 Package Codes
Type
Package
Temperature range
Code & marking
TMC2130-LA
QFN36 (RoHS)
-40°C ... +125°C
TMC2130-LA
TMC2130-TA
TQFP-EP48 (RoHS)
-40°C ... +125°C
TMC2130-TA