User's Manual

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DT‐0237A page11of24 Rev:1.0
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CONFIDENTIAL
DISTRIBUTED UNDER LICENSE
5 HostPCBRequirements
RecommendedFootprint
The footprints shown below are available upon request as a PAD Layout source file.
OSDI-4000-1X

Overall (L x W x H), including shield: 29.8 x 35.3 x 4.0mm

Suggested Silkscreen Outline (L x W): 30.3 x 35.8mm

Avoid vias, traces or copper inside Keep-Out Areas
Figure 6 Footprint OSDI-4000-1X
PasteMask
Paste Mask Stencil openings can be of the same size as the recommended footprint (1:1); suggested thickness of stencil foil ≥ 120µm.
Layoutrequirements
 Traces routed to RF_EXT pad must be 50 ohm.
 Traces current rating:
+VCPU ≥ 90 mA
+3.3V ≥ 90 mA
+VLDO_IN ≥ 1.4 Amp
+V1.5F_SW ≥ 90mA
 Thermal reliefs are strongly recommended for all pads connected to Ground net.
 Finish recommendation for PCB pad surfaces: ROHS Compliant (EU Directive 2002/95/EC) 2-10 µIN Immersion Gold Over 50-
200µIN Electro less Nickel (ENIG)
 Non Solder Mask Defined (NSMD) type is recommended for the solder pads on the PCB.