Datasheet

T
T
T
S
S
S
3
3
3
2
2
2
M
M
M
L
L
L
D
D
D
6
6
6
4
4
4
V
V
V
3
3
3
F
F
F
I
I
I
184PIN DDR333 Unbuffered DIMM
256MB With 32Mx8 CL2.5
Description
The TS32MLD64V3FI is a 32M x 64bits Double Data Rate
SDRAM high-density for DDR333. The TS32MLD64V3FI
consists of 8pcs CMOS 32Mx8 bits Double Data Rate
SDRAMs in 66 pin TSOP-II 400mil packages and a 2048
bits serial EEPROM on a 184-pin printed circuit board. The
TS32MLD64V3FI is a Dual In-Line Memory Module and is
intended for mounting into 184-pin edge connector
sockets.
Synchronous design allows precise cycle control with the
use of system clock. Data I/O transactions are possible on
both edges of DQS. Range of operation frequencies,
programmable latencies allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
Features
Power supply: VDD: 2.5V ± 0.2V, VDDQ: 2.5V ± 0.2V
Max clock Freq: 166MHZ.
Double-data-rate architecture; two data transfers per
clock cycle
Differential clock inputs (CK and /CK)
Burst Mode Operation.
Auto and Self Refresh.
Data I/O transactions on both edge of data strobe.
Edge aligned data output, center aligned data input.
Serial Presence Detect (SPD) with serial EEPROM
SSTL-2 compatible inputs and outputs.
MRS cycle with address key programs.
CAS Latency (Access from column address) : 2.5
Burst Length (2,4,8 )
Data Sequence (Sequential & Interleave)
Placement
H
G
E
I
F
A
B
D
C
PCB : 09-1670
Transcend Information Inc.
1

Summary of content (11 pages)