Data Sheet

2
Revision History
Revision No.
History
Released Date
Editor by
1.0
First version (WD BICS4)
2020/05/26
TSD
1.1
Add Corner Bond process information
Supports DEVSLP mode (Default)
2020/07/01
TSD
1.2
Extended the Temperature Storage from -55°C to 85°C
Added 5.2.13 Early Move Function
Added 5.2.14 Read Retry Function
2020/08/25
TSD