Datasheet

Thermal Consideration
TMR 9WI Series
Specifications can be changed without notice!
Make sure you are using the latest documentation, downloadable at www.tracopower.com
Application note: tmr9wi-thermal-consideration
page 2 of 2, rev.: June 9, 2017
For reducing the case temperature and thus increasing the modul life time, the following PCB layout is suggested.
PCB layout suggestion
Model: TMR 9-4815WI (Vin=48V; Full Load)
Conduction
Ambient
temperature
Metal case
temperature
Temperature
difference
Images of thermal camera
Case pin is not connected to PCB
foil circuit.
28.3°C 59.1°C 30.8°C
Case pin is connected to PCB foil
circuit.
28.2°C 54.8°C 26.6°C
The following table shows the effect of the suggested PCB layout.
Case pin soldering point (green
section is the connected PCB foil)
Metal case dimension
Dimensions in mm ; pcb foil with thickness 69.58 µm (2 oz)
BOTTOM VIEW