Datasheet

23
T5557
4517E–RFID–02/03
Figure 27. 4 Pad Flip-chip Version with 70 µm Solder Bumps
Figure 28. Solder bump on NiAu
C2
994
934
94
157
142
497
100
100
Dimensions in µm
T5557C4
60
60
124
97
107
92
82
97
82
Passivation
AL bondpad
Ni
PbSn
70µm