Datasheet

21
T5557
4517E–RFID–02/03
Ordering Information
(2)
Notes: 1. Unique customer ID code programming according to Figure 5 is linked to a minimum order quantity of 1 Mio parts per year.
2. For available order codes refer to Atmel Sales/Marketing.
Ordering Examples
(Recommended)
T555711-DDW Tested dice on unsawn 6” wafer, thickness 300 mm, no on-chip
capacitor, no damping during POR initialisation;
especially for ISO 11784/785 and access control applications
Available Order Codes T555711-DDW, DDT, TAS, PP
T555714-DDW, DBW, TAS
T555715-PAE
11 - 2 Pads without on-chip C see Figure 26
14 - 4 Pads with on-chip 75 pF see Figure 27
15 - Micro - Module with 330 pF see Figure 29
01 - 2 Pads without C; Damping during initialisation see Figure 26
Customer ID
(1)
- Atmel standard (corresponds to “00")
M01 - Customer ’X’ unique ID code
(1)
- DDW - Dice on wafer, 6" un-sawn wafer, thickness 300 µm
- DDT - Dice in Tray (waffle pack), thickness 300 µm
- DBW - Dice on solder bumped wafer, thickness 390 µm see Figure 27
Sn63Pb37 on 5 µm Ni/Au, height 70 µm see Figure 28
- TAS - SO8 Package see Figure 31
- PAE - MOA2 Micro-Module see Figure 29
- PP - Plastic Transponder see Figure 33
x x x
T 5 5 5 7 a b M c c - Package
Drawing