Datasheet

19
T5557
4517E–RFID–02/03
Absolute Maximum Ratings
Parameters Symbol Value Unit
Maximum DC current into Coil 1/Coil 2 I
coil
20 mA
Maximum AC current into Coil 1/Coil 2
f = 125 kHz
I
coil p
20 mA
Power dissipation (dice)
(free-air condition, time of application: 1 s)
P
tot
100 mW
Electrostatic discharge maximum to
MIL-Standard 883 C method 3015
V
max
4000 V
Operating ambient temperature range T
amb
-40 to +85 °C
Storage temperature range (data retention reduced) T
stg
-40 to +150 °C
Electrical Characteristics
T
amb
= +25°C; f
coil
= 125 kHz; unless otherwise specified
No. Parameters Test Conditions Symbol Min. Typ. Max. Unit Type*
1 RF frequency range f
RF
100 125 150 kHz
2.1
Supply current
(without current
consumed by the
external LC tank circuit)
T
amb
= 25°C
(1)
(see Figure 24)
I
DD
1.5 3 mAT
2.2
Read – full temperature
range
24
mAQ
2.3
Programming full
temperature range
25 40
mAQ
3.1
Coil voltage (AC supply)
POR threshold
(50 mV hysteresis)
V
coil pp
3.2 3.6 4.0 V Q
3.2
Read mode and write
command
(2)
6V
clamp
VQ
3.3 Program EEPROM
(2)
8V
clamp
VQ
4 Start-up time V
coil pp
= 6 V t
startup
2.5 3 ms Q
5 Clamp voltage
10 mA current into
Coil 1/2
V
clamp
17 23 V T
6.1
Modulation parameters
V
coilpp
= 6 V on test circuit
generator and
modulation ON
(3)
V
mod pp
4.2 4.8 V T
6.2 I
mod pp
400 600 mAT
6.3 Thermal stability V
mod
/T
amb
-6 mV/°CQ
*) Type means: T: directly or indirectly tested during production; Q: guaranteed based on initial product qualification data
Notes: 1. I
DD
measurement setup R = 100 k; V
CLK
= V
coil
= 5 V: EEPROM programmed to 00 ... 000 (erase all); chip in modulation
defeat. I
DD
= (V
OUTmax
- V
CLK
)/R
2. Current into Coil 1/Coil 2 is limited to 10 mA. The damping circuitry has the same structure as the e5550. The damping
characteristics are defined by the internally limited supply voltage (= minimum AC coil voltage)
3. V
mod
measurement setup: R = 2.3 k; V
CLK
= 3 V; setup with modulation enabled (see Figure 25).
4. Since EEPROM performance is influenced by assembly processes, Atmel confirms the parameters for DOW (tested dice
on uncutted wafer) delivery.
5. The tolerance of the on-chip resonance capacitor C
r
is ±10% at 3s over whole production. The capacitor tolerance is
±3% at 3
s on a wafer basis.
6. The tolerance of the microcodule resonance capacitor C
r
is ±5% at 3s over whole production.