Toshiba Personal Computer Satellite A40 Series Maintenance Manual TOSHIBA CORPORATION File Number 960-458
Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer Satellite A40 Series Maintenance Manual First edition December 2003 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite A40 Series. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite A40 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram ...................................................................................... 1-6 1.3 USB 3.5-inch Floppy Disk Drive ............................................................................ 1-12 1.4 2.5-inch Hard Disk Drive.......................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-3 3.3 Subtest Names............................................................................................................ 3-8 3.4 System Test............................................................................
Chapter 4 Replacement Procedures 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card..................................................................................................................... 4-10 4.4 SD card.........................................................
Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
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Chapter 1 Hardware Overview
1 Hardware Overview 1-ii Satellite A40 Maintenance Manual (960-458)
1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram.......................................................................................1-6 1.3 USB 3.5-inch Floppy Disk Drive .............................................................................1-12 1.4 2.5-inch Hard Disk Drive ..............................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-5 Figure 1-2 System unit configuration .............................................................................. 1-5 Figure 1-3 System unit block diagram............................................................................. 1-6 Figure 1-4 3.5-inch FDD (USB External) .....................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Toshiba Satellite A40 Personal Computer is a high performance all-in-one PC running a Pentium 4 or Celeron processor. Microprocessor Intel Mobile Pentium 4 Processor (Northwood) A 2.40GHz, 2.66GHz, 2.80GHz, 3.06GHz or 3.20GHz Pentium 4 processor (Northwood) with a 2.40GHz, 2.66GHz, 2.80GHz, 3.06GHz or 3.20GHz internal clock, 533MHz bus and 1.525/1.20V core operation Intel Mobile Pentium 4 Processor (Prescott) A 2.66GHz, 2.80GHz, 3.06GHz, 3.
1 Hardware Overview 1.1 Features Built-in HDD The computer has a 30GB, 40GB, 60GB or 80GB internal drive of 2.5 inch x 9.5mm height. USB FDD An external two-mode 3.5-inch FDD, which connects with a USB port, supports 720KB and 1.44MB formats and enables booting from system FD. DVD-ROM Drive This drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD-R/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second).
1.1 Features 1 Hardware Overview Display The display comes in the following three types: • 14.1-inch XGA TFT LCD (1024 × 768 pixels with 16M colors) • 15.0-inch XGA TFT LCD (1024 × 768 pixels with 16M colors) • 15.0-inch SXGA+ TFT LCD (1400 × 1050 pixels with 16M colors) Keyboard An easy-to-use 85(US)-/86(UK)-key keyboard (101 Key emulation). A Windows key is supported. Touch pad A touch pad is installed as a pointing device. Batteries A RTC battery is mounted inside the computer.
1 Hardware Overview 1.1 Features SD Card The SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, which use SD Card flash-memory.
1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1 and the system unit configuration is shown in figure 1-2.
1 Hardware Overview 1.2 1.2 System Unit Block Diagram System Unit Block Diagram Figure 1-3 is a block diagram of the system unit.
1.2 System Unit Block Diagram 1 Hardware Overview The system unit is composed of the following major components: Processor Intel Mobile Pentium 4 Processor (Northwood) • • • 2.40/2.66/2.80/3.06/3.20GHz (Internal clock: 2.40/2.66/2.80/3.06/3.20GHz, Bus: 533MHz, Core voltage: 1.525/1.20V (Battery Optimized Mode at 1.20V), Built-in NDP) Internal cache memory: 12KB (in CPU) Secondary cache memory: 512KB (in CPU) Intel Mobile Pentium 4 Processor (Prescott) • • • 2.66/2.80/3.06/3.20/3.
1 Hardware Overview 1.2 System Unit Block Diagram Intel Montara-GT (North Bridge) • • One Intel 82852GME is used. Features: – Mobile Intel Pentium 4 processor and Intel Celeron processor System Bus Support – Supports Enhanced Intel SpeedStep technology – DRAM Controller supporting DDR333/DDR266/DDR200, 2GB max – Accelerated Graphics Port (AGP) Interface: Supports AGP 2.0 including 1×, 2×, and 4× – Up to 64MB of dynamic video memory allocation – 732-pin Micro-FCBGA (37.5×37.
1.2 System Unit Block Diagram 1 Hardware Overview PC Card Controller Gate Array • • One YEBISU-SS gate array is used. This gate array has the following functions and components. – PCI interface (PCI Revision2.2) – CardBus/PC Card controller (Yenta2 Version2.2) – SD memory card controller (SDHC Ver.1.2) – SD IO card controller (Ver.1.0) – SmartMedia controller (SMHC Ver.01/SMIL1.0) – SIO (UART) controller (MS Debug Port Specification Ver.1.
1 Hardware Overview 1.2 System Unit Block Diagram VGA Controller Included in the North Bridge Sound Controller AC 97’ Link (in the South Bridge) is used. • Amplifier, internal stereo speakers, stereo headphone connector, external microphone connector and volume control knob are mounted. EC/KBC (Embedded Controller/Keyboard Controller) One SMSC LPC-47N259 micon chip functions as both EC and KBC.
1.2 System Unit Block Diagram 1 Hardware Overview Clock Generator • • One ICS 950812 is used. This device generates the system clock. Modem Controller • • One built-in Askey-made 1456VQL4A(INT) modem card This controller has the following functions: – Digital line protection support – Ring wake up support – AC97 interface – Supports V.92 56k Modem/Fax. Internal LAN Controller • One Kinnereth (ED82562) chip is used. – Supports 100Base-TX and 10Base-T. – Controls LAN.
1 Hardware Overview 1.3 1.3 USB 3.5-inch Floppy Disk Drive USB 3.5-inch Floppy Disk Drive The 3.5-inch USB FDD is a thin, high-performance reliable drive that supports 720KB and 1.44MB. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.5-inch FDD specifications Items Data transfer rate FDD part USB Disk rotation speed Track density 1-12 720KB mode 250K bits/second 1.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 30GB, 40GB, 60GB and 80GB HDD. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2 and 1-3. Figure 1-5 2.5-inch HDD Table 1-2 2.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD dimensions (2/2) Parameter Specifications IBM G8BC0000Z410 IBM G8BC0000Z310 Outline Width (mm) 69.85 dimensions Height (mm) Depth (mm) Weight (g) 9.5 100.2 Parameter 95 max. 99 max. Specifications IBM IBM G8BC00014610 G8BC0000Z810 Outline Width (mm) 69.85 69.85 dimensions Height (mm) 9.5 9.5 Depth (mm) 100.2 100.2 102 max. 99 max.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-3 2.5-inch HDD specifications (1/3) Specifications Parameter TOSHIBA HDD2181B TOSHIBA HDD2190B TOSHIBA HDD2183B 30GB 40GB 60GB Storage size (formatted) Speed (RPM) Data transfer speed (Mb/sec) 4200 154.3-298.0 Interface transfer rate (MB/s) 175.0–341.7 154.3-298.0 100 max. (Ultra DMA mode) Track density (Ktpi) 78.9 88.1 Access Time Average seek (sec) 78.9 12 Start time (sec) 4 typ.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-3 2.5-inch HDD specifications (2/3) Specifications Parameter Storage size (formatted) IBM G8BC0000Z310 IBM G8BC0000Z410 IBM G8BC0000Z610 30GB 40GB 60GB Speed (RPM) 4200 Data transfer speed (Mb/sec) - Interface transfer rate (MB/s) 100 max. (Ultra DMA mode) Track density (Ktpi) 63 Access Time Average seek (Read) Average seek (Write) 12 typ. 14 typ.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-3 2.5-inch HDD specifications (3/3) Specifications Parameter HITACHI G8BC00017310 HITACHI G8BC00017410 HITACHI G8BC00017610 30GB 40GB 60GB Storage size (formatted) Speed (RPM) Data transfer speed (Mb/sec) 4200 183.2-347.2 187.2-351.2 Interface transfer rate (MB/s) 100 max. (Ultra DMA mode) Track density (Ktpi) 80 Access Time Average seek (Read) Average seek (Write) 13 typ.
1 Hardware Overview 1.5 1.5 DVD-ROM Drive DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-ROM drive is shown in Figure 1-6. The specifications of the DVD-ROM drive are described in Table 1-4.
1.5 DVD-ROM Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (2/2) Specifications Hitachi G8CC00015810 Item DVD-ROM Burst data transfer rate (MB/s) CD-ROM DVD-RAM 33.3 (Ultra DMA Mode 2) Transfer rate (MB/s) 10.8 (Single/Dual layer) 90 (Single) 130 (Dual) Average random access time (ms) Data buffer capacity (KB) DVD Supported formats CD 3.6 2.7 (2.6GB/4.7GB Disc) 85 250 (4.7 GB Disc) 256 DVD-ROM, DVD-RAM (2.6GB/4.7GB, read only), DVD-R (3.95GB/4.7GB, read only), DVD-RW (4.
1 Hardware Overview 1.6 1.6 CD-RW/DVD-ROM Drive CD-RW/DVD-ROM Drive This drive is a combination of DVD-ROM and CD-R/RW Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. This drive reads CD-ROM at maximum 24-speed, reads DVD-ROM at maximum 8-speed. The CD-RW/DVD-ROM drive is shown in figure 1-7. Specifications are listed in Table 1-5.
1.6 CD-RW/DVD-ROM Drive 1 Hardware Overview Table 1-5 CD-RW/DVD-ROM drive specifications (2/3) Specifications Item Transfer rate Average access time (ms) HITACHI G8CC0001K810 For read (CD-ROM) 3,600KB/sec. max For read (DVD-ROM) 11.
1 Hardware Overview 1.6 CD-RW/DVD-ROM Drive Table 1-5 CD-RW/DVD-ROM drive specifications (3/3) Item Burst data transfer rate (MB/s) Specifications Toshiba SDR2412OAA 16.7 (PIO Mode 4) 16.7 (Multi-word DMA Mode 2) 33.3 (Ultra DMA Mode 2) Average random access time (ms) CD-ROM: 105, DVD-ROM: 120, DVD-RAM: 130 (Typ.) Average random seek time (ms) CD-ROM: 105, DVD-ROM: 120, DVD-RAM: 130 (Typ.) Average full stroke access time (ms) CD-ROM: 105, DVD-ROM: 120, DVD-RAM: 130 (Typ.
1.7 DVD-R/-RW Drive 1.7 1 Hardware Overview DVD-R/-RW Drive A full-size DVD-R/-RW drive module lets you record data to rewritable CD/DVD as well as run either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVDs without using an adaptor. It is a high-performance drive that reads DVD at maximum 8-speed, writes DVD-R/-RW at 1speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-R/-RW drive is shown in figure 1-8. Specifications are listed in Table 1-6.
1 Hardware Overview 1.7 DVD-R/-RW Drive Table 1-6 DVD-R/-RW drive specifications Toshiba SD-R6112 Item ATAPI Burst (MB/sec) 33.3 (Ultra DMA mode 2) 16.
1.8 DVD±RW (DVD Dual) Drive 1.8 1 Hardware Overview DVD±RW (DVD Dual) Drive This full size DVD±RW drive module lets you record data to rewritable CD/DVDs as well as run either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD without using an adaptor. It is a high-performance drive that reads DVD at maximum 8-speed, writes DVD-R/-RW at 2speed, DVD+R/+RW at 2.4-speed and reads CD at maximum 24-speed (3,600 KB per second). The DVD multi drive is shown in Figure 1-9.
1 Hardware Overview 1.8 DVD±RW (DVD Dual) Drive Table 1-7 DVD±RW drive specifications Pioneer G8CC0001L810 Item ATAPI Burst (MB/sec) 33.3 (Ultra DMA mode 2) 16.6 (PIO Mode 4, Multi word DMA mode 2) Average access time (ms) DVD-ROM CD-ROM 150 130 Data buffer (MB) 2 Speed (Read) DVD-ROM CD-ROM 8x 24x Speed (Write) CD-R CD-RW DVD-R DVD-RW DVD+R DVD+RW 4x, 8x, 12x, 16x 4x,10x (High Speed) 1x, 2x (4x) 1x, (2x) 2.4x (4x) 2.
1.9 DVD-Multi (CD-R/RW DVD-RAM/R/RW) Drive 1.9 1 Hardware Overview DVD-Multi (CD-R/RW DVD-RAM/R/RW) Drive This drive is a combination of CD-R/RW, DVD-R/-RW and DVD-RAM Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. It is a high-performance drive that reads DVD at maximum 8-speed, writes DVD-R/-RW at 1speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD multi drive is shown in Figure 1-10.
1 Hardware Overview 1.9 DVD-Multi (CD-R/RW DVD-RAM/R/RW) Drive Table 1-8 DVD-Multi drive specifications (2/2) Specifications Item TEAC G8CC00013810 DVD-ROM CD-ROM DVD-RAM Burst data transfer rate (MB/s) 33.3 (Ultra DMA mode 2) 16.7 (PIO Mode 4, Multi-word DMA mode 2) Access time (ms) 1/3 Stroke Access (typ.) 130 Data buffer capacity Supported formats 1-28 110 - 2MB DVD DVD-VIDEO, DVD-ROM, DVD-R (General, Authoring), DVD-RW, DVD-RAM(4.7GB, 2.
1.10 Keyboard 1 Hardware Overview 1.10 Keyboard The keyboard mounts 85(US)/86(UK) keys that consist of character key and control key. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-11 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.11 1.11 TFT Color Display TFT Color Display The TFT color display consists of 14.1-inch (XGA) or 15.0-inch (XGA, SXGA+) LCD module and FL inverter board. 1.11.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. North Bridge can control both internal and external XGA- or SXGA+- support displays simultaneously.
1.11 TFT Color Display 1 Hardware Overview Table 1-9 LCD module specifications (15.0-inch XGA TFT) (2/3) Specifications Item G33C0000M 110 G33C0000K 110 G33C0000L 110 G33C0000Q 110 Number of Dots 1,024(W) x 768(H) Dot spacing (mm) 0.297(H) x 0.297(V) Display range (mm) G33C0000Q 310 304.128(H) x 228.096(V) Table 1-9 LCD module specifications (15.0-inch SXGA+ TFT) (3/3) Specifications Item G33C0000P110 Number of Dots G33C0000R110 1,400(W) x 1,050(H) Dot spacing (mm) 0.2175(H) x 0.
1 Hardware Overview 1.12 Power Supply 1.12 Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Checks power input to determine: • Whether the AC adaptor is connected to the computer. • Whether the battery pack is installed and supplying power. 2. Checks power supply’s internal controls: • • • • • Battery pack charging: start, stop and voltage supplied to the battery pack.
1.12 Power Supply 1 Hardware Overview Table 1-11 Power supply output rating Name Voltage (V) Use PPV 1.308-0.844 PGV 1.20 GPU (NV34M) 1R25-B1V 1.25 DDR-SDRAM Termination MR1R25-B1V 1.25 DDR-SDRAM, GMCH 1R5-P1V 1.5 GMCH, ICH4-M, TV, LAN Power 1R5-S1V 1.5 ICH4-M 2R5-P2V 2.5 GPU (NV34M) 2R5-B2V 2.5 GMCH, DDR-SDRAM P3V 3.3 Clock Generator, Thermal Sensor, GMCH, SDRAM(SPD), TV, LCD, ICH4-M, LAN Power, KINNERETH, AD1981B, Mini-PCI, EC/KBC, FIR E3V 3.
1 Hardware Overview 1.13 Batteries 1.13 Batteries The computer has two types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-12. Table 1-12 Battery specifications Battery name Main battery G71C00023510 G71C00023610 RTC battery 1.13.1 P71035017110 Material Output voltage Capacity Lithium-Ion (12 cell) 10.8 V 8,400mAh Nickel-metal hydride 3.
1.13 Batteries 1.13.2 1 Hardware Overview Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery using quick charge.
1 Hardware Overview 1.13.3 1.13 Batteries RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-14 lists the charging time and data preservation period of the RTC battery.
Chapter 2 Troubleshooting Procedures
2 Troubleshooting Procedures 2-ii Satellite A40 Maintenance Manual (960-458)
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting..........................................................................................................2-1 2.2 Troubleshooting Flowchart ........................................................................................2-2 2.3 Power Supply Troubleshooting ..................................................................................2-6 2.4 2.5 2.6 2.7 Procedure 1 Icon Check .........................................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2-iv Display Troubleshooting.......................................................................................... 2-44 Procedure 1 External Monitor Check ............................................................ 2-44 Procedure 2 Diagnostic Test Program Execution Check .............................. 2-44 Procedure 3 Connector and Cable Check ......................................................
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart .............................................................................2-3 Figure 2-2 Printer port LED ...........................................................................................2-21 Figure 2-3 Printer port LED board.................................................................................2-21 Figure 2-4 Antenna test cable ............................................................................
2 Troubleshooting Procedures 2-vi Satellite A40 Maintenance Manual (960-458)
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. Power supply 5. Keyboard 9. LAN 2. System Board 6. Display 10. Wireless LAN 3. Floppy Disk Drive 7. Optical Drive 11. Sound components 4. Hard Disk Drive 8. Modem 12. SD Card Slot The Diagnostics Disk operations are described in Chapter 3.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask the user if a password is registered and, if it is, ask him or her to enter the password.
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2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*3 Doesn’t light Any condition other than those above *3 When the power supply controller detects a malfunction, the DC IN LED blinks and an error code is displayed. If the icon blinks, execute the followings: 1. Remove the battery and AC adapter to cut power supply to the computer. 2.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for a half second Interval between data bits Off for a half second The error code begins with the least significant digit.
2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. The error code begins with the least significant digit. Error code Table 2-3 Error code Error code Where Error occurs 1*h DC Power (AC Adapter) 2*h 1st battery 3*h 2nd battery 4*h S3V output (3.3V) 5*h 1R5-C1V output (1.5V) 6*h 1R5-C1V output (1.5V) 7*h FAN12V-PXP output 8*h PPV output 9*h E5V output (5.
2 Troubleshooting Procedures Check 1 2.3 Power Supply Troubleshooting Compare the patterns in the hexadecimal error code to the tables below. DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5 V. 11h Advanced Port Replicator output voltage is over 16.5 V. 12h Current from the DC power supply is over the limit (15.4 A). 13h Current from the DC power supply is over the limit (0.5 A), when there is no load. 14h Current sensing IC is not normal, when there is no load.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R5-C1V output Error code Meaning 50h 1R5-C1V voltage is over 1.80 V, when the computer is powered on/off. 51h 1R5-C1V voltage is 1.275V or under, when the computer is powered on. 52h 1R5-C1V voltage is 1.275V or under, when the computer is booting up. 53h 1R5-C1V voltage is 1.275V or under, when the computer is suspended. 54h 1R5-C1V voltage is not normal, when the computer is shutdown. 55h 1R5-C1V voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PPV output Error code Meaning 80h PPV voltage is over 1.92 V, when the computer is powered on/off. 81h PPV voltage is 0.64 V or under, when the computer is powered on. 82h PPV voltage is 0.64 V or under, when the computer is booting up. 83h PPV voltage is 0.64 V or over, when the computer is powered off. 84h PPV voltage is 0.64 V or under, when the computer is suspended.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R25-B1V output Error code Meaning C0h 1R25-B1V voltage is over 1.50 V, when the computer is powered on/off. C1h 1R25-B1V voltage is 1.063 V or under, when the computer is powered on. C2h 1R25-B1V voltage is 1.063 V or under, when the computer is booting up. C3h 1R25-B1V voltage is 1.063 V or over, when the computer is powered off. C4h 1R25-B1V voltage is 1.063 V or under when the computer is suspended.
2 Troubleshooting Procedures Check 2 2.3 Power Supply Troubleshooting In the case of error code 10h or 12h: Make sure the AC adaptor cord and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: Connect a new AC adaptor and/or AC power cord, if necessary. If the error still exists, go to Procedure 5. Check 3 In the case of error code 2Xh: Make sure the battery pack is correctly installed in the computer.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks. If the power cord is damaged, replace it with a new one. If there is no damage, go to Check 2. Check 2 Make sure the AC cord is firmly connected to the AC wall outlet and to the AC adaptor.
2 Troubleshooting Procedures Procedure 4 2.3 Power Supply Troubleshooting Charge Check The power supply may not charge the battery pack. Perform the following procedures: 1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5. 3. Run the Diagnostic test, go to System test and execute subtest 06 (Quick charge) described in Chapter 3. 4. When charge is complete, the diagnostics test displays the result code.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one. If the AC adaptor still does not function properly, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is defective or not. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Printer Port LED Check The printer port LED displays the IRT status and test status by turning lights on and off as an eight-digit binary value for boot mode. Figure 2-2 shows the printer port LED. Figure 2-2 Printer port LED Figure 2-3 shows the function of the printer port LED board.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting To use the printer port LED, follow the steps below: 1. Turn on the computer’s power and set it to boot mode. 2. Turn off the computer’s power. 3. Plug the printer port LED into the parallel port. 4. While holding down the space bar, turn on the computer’s power. 5. Read the LED status from left to right. 6. Convert the status from binary to hexadecimal notation. 7. If the final LED status is FFh (normal status), go to Procedure 4. 8.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED status (2/8) LED Status (B6h) Test item (BIOS rewrite) Contents Cancel of sound mute Setting of volume to max. Display of messages (EC/KBC UPDATE/DAMAGED, BIOS UPDATE/DAMAGED) Key input Prohibition of USB BEEP Waiting for Key input Reading of CHGBIOSA.EXE/CHGFIRMA.EXE FDC RESET Setting of parameters for 2HD (1.44MB) Reading of first sector, If it is the data of 1.44MB (2HD), the media type is definite.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED status (8/8) LED Status (1Ch) Test item (PRE_BOOT_SETUP) Contents Updating of table for DMI Copy of ACPI table to top of expansion memory Waiting for completion writing of PSC version to BIOS Waiting for clock generator setting completion (The system halts in LED = 1DH when an error is detected.
2.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting NOTE: The printer port LED outputs the status of an item in which an error is occurred. If the printer port LED outputs “0Ch” and then halts, it indicates memory check of first 64KB is completed and an error occurred during initialization of vector. Check 1 If the following error codes are displayed, go to Procedure 5.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. Hard Disk test 8. Real Timer test 9. NDP test 10. Expansion test 11. CD-ROM/DVD-ROM test 12. LAN 13. Wireless LAN test 14.
2 Troubleshooting Procedures Procedure 4 2.4 System Board Troubleshooting Replacement Check The system board connectors may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1. Check 1 Visually check for the following: a) Cracked or broken connector housing b) Damaged connector pins If connectors are in good condition, but there is still a problem, go to Check 2. Check 2 2-34 The system board may be damaged.
2.5 FDD Troubleshooting 2.5 2 Troubleshooting Procedures FDD Troubleshooting This section describes how to determine if the FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-6. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
2.5 FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The 3.5inch FDD is connected to the System Board via USB port. Check 1 Make sure the USB cable is securely connected to the FDD. Also, make sure the USB cable of the FDD is securely connected to the connector PJ4600 or PJ4601 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 2. If any connector is damaged, replace it with a new one and repeat Procedure 2.
2 Troubleshooting Procedures 2.6 2.6 HDD Troubleshooting HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.6 HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Check 3. Check 2 Type FDISK and press Enter. Choose Display Partition Information from the FDISK menu. If drive C is listed, go to Check 3.
2 Troubleshooting Procedures Procedure 3 2.6 HDD Troubleshooting Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required. Check 1 Format the HDD and transfer system files using FORMAT C:/S/U. If the following message appears on the display, the HDD is formatted.
2.6 HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 5 2.6 HDD Troubleshooting Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to the system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 2.7 Keyboard Troubleshooting Connector and Replacement Check The keyboard, PAD I/F and PAD Switch may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: 1. If the keyboard malfunctions, start with Check 1. 2. If the PAD switch malfunctions, start with Check 3. Check 1 Make sure the keyboard cable is securely connected to the system board.
2.8 Display Troubleshooting 2.8 2 Troubleshooting Procedures Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 3 2.8 Display Troubleshooting Connector and Cable Check The LCD Module is connected to the system board by an LCD/FL cable. The FL inverter board is also connected to the system board by an LCD/FL cable. And the FL is connected to the FL inverter board by the HV cable. The connectors may be disconnected from the system board or the FL inverter board, or they may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
2.8 Display Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If the FL does not light, perform Check 1. If characters or graphics are not displayed clearly, perform Check 4.
2 Troubleshooting Procedures 2.9 2.9 Optical Drive Troubleshooting Optical Drive Troubleshooting This section describes how to determine if the Optical Drive is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.9 Optical Drive Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The Optical Drive is connected to the system board. The connectors may be disconnected from the system board or may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the Optical Drive is firmly connected to the system board.
2 Troubleshooting Procedures 2.10 Modem Troubleshooting 2.10 Modem Troubleshooting This section describes how to determine if the computer's modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Sound/LAN/Modem test program is stored in the Diagnostics Disk.
2.10 Modem Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The Modem is installed as a modem daughter card (MDC). If the modem malfunctions, there may be a bad connection between the MDC and the System Board. Or the MDC, System Board or their connectors might be damaged.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.11 LAN Troubleshooting This section describes how to determine if the computer's LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Sound/LAN/Modem test program is stored in the Diagnostics Disk.
2.12 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.12 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.12 Wireless LAN Troubleshooting Antennas' Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the wireless LAN is still not functioning properly, perform Check 2.
2.12 Wireless LAN Troubleshooting Procedure 3 Check 1 2 Troubleshooting Procedures Antenna Check Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the wireless LAN slot cover and lift it off. Refer to Chapter 4, Replacement Procedures, for detailed steps of disassembling. 2. Disconnect the wireless LAN antenna cables connected to the wireless LAN board. 3. Connect the end of the antenna test cable to the multimeter. 4.
2 Troubleshooting Procedures Procedure 4 2.12 Wireless LAN Troubleshooting Replacement Check The wireless LAN board is connected to the power board and the system board. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Replace the wireless LAN board with a new one following the instructions in Chapter 4, Replacement Procedures and test the display again.
2.13 Sound Troubleshooting 2 Troubleshooting Procedures 2.13 Sound Troubleshooting This section describes how to determine if the computer's sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.13 Sound Troubleshooting Connector Check The sound function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: If the stereo speakers do not work correctly, perform Check 1. If headphones do not work correctly, perform Check 2. If sound recording does not work correctly, perform Check 3.
2.13 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 If the stereo speakers do not sound properly, the stereo speakers may be defective or damaged. Replace them with new ones. If the stereo speakers still do not work properly, go to Check 4. Check 2 If headphones does sound properly, the headphone jack may be defective or damaged, or the SD board may be defective. Replace the SD board with a new one.
2 Troubleshooting Procedures 2.14 SD Card Slot Troubleshooting 2.14 SD Card Slot Troubleshooting To check if the SD card slot is good or not, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows Procedure 2: Connector/Replacement Check Procedure 1 Check on Windows Insert a SD card into the slot. Check if Windows recognizes automatically the SD card and the data in the SD card can be read. If the card is not recognized or data are not read, go to Procedure 2.
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Chapter 3 Tests and Diagnostics
3 Tests and Diagnostics 3-ii Satellite A40 Maintenance Manual (960-458)
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-3 3.3 Subtest Names............................................................................................................ 3-8 3.4 System Test................................................................
3 Tests and Diagnostics 3.23 3.22.1 Function Description .......................................................................... 3-50 3.22.2 Operations .......................................................................................... 3-51 Setup ........................................................................................................................ 3-52 3.23.1 Function Description .......................................................................... 3-52 3.23.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Test Program is stored on the Diagnostic Disk. NOTES: To start the diagnostics, follow these steps: 1. Check all cables for loose connections. 2. Exit any application you may be using and close Windows.
3 Tests and Diagnostics 3.1 The Diagnostic Test There are following four test programs other than the DIAGNOSTIC test program: Sound/LAN/MODEM TEST Wireless LAN TEST IEEE 1394 TEST Thermal Radiation Control Test You will need the following equipment to perform some of the Diagnostic test programs.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive and turn on the computer while pressing U key. (The Diagnostics Disk contains the MS-DOS boot files.) The following menu will appear: 1.Repair Main (T&D) 2.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test When “1.Repair Main (T&D)” is selected and Enter key is pressed, the following menu will appear. Refer to sections 3.18 through 3.23 for detailed descriptions of item 4 through 8 and 0 (Service programs). NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program, or press Ctrl + C to stop the test program.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 2. To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXXXX DIAGNOSTICS Version X.XX (C) Copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 3. Select the test you want to execute and press Enter. When SYSTEM TEST is selected, the following message will appear: SYSTEM TEST XXXXXXX XXX DIAGNOSTIC TEST VX.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 5. The following message will appear: ERROR STOP : YES/NO Selecting YES stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: [1] Terminates the test program and exits to the subtest menu. [2] Continues the test.
3 Tests and Diagnostics 3.3 3.3 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-8 Test Name Subtest No.
3.3 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
3 Tests and Diagnostics 3.4 3.4 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board.
3.4 System Test Subtest 07 3 Tests and Diagnostics DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number PCN/BND Number UUID Number : : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXX/XXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
3 Tests and Diagnostics 3.4 System Test 7. “Create DMIINFO TXT (Y/N) ?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. Subtest 09 Thermister check This subtest reads the status (normal/open/short) of the [Thermister connect check] of the PS micon. When it is not normal, an error message is displayed. When it is normal, the display returns to the main menu.
3.5 Memory Test 3.5 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.6 3.6 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed.
3.6 Keyboard Test Subtest 04 3 Tests and Diagnostics Touch pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 05 3.6 Keyboard Test USB (Port 0, Port1) test This subtest checks USB. The USB TEST Module (ZD0003P01) and USB Cable (ZD0003P02) must be connected to the computer. The following message will appear. Select a port to test and press Enter. Test port number select (1:Port0, 2:Port1, 0:Port0&1) ? If the test ends successfully, OK is displayed. If there is a problem with the USB port, an error message appears. Check the wraparound connection and repeat the test.
3.7 Display Test 3.7 3 Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.7 Display Test Gradation & mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 64K] 640*480 16M] 800*600 64K] 800*600 16M] 1024*768 64K] 1024×768 16M] The display below appears on the screen when this subtest is executed.
3.7 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.8 3.8 Floppy Disk Test Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
3.8 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK IN PROGRESS XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop SUB-TEST : XX PASS COUNT : XXXXX ERROR COUNT : XXXXX WRITE DATA : XX READ DATA : XX ADDRESS : XXXXXX STATUS : XXX 3. When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.9 3.9 Printer Test Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test. NOTE: A Port Replicator and an IBM compatible printer must be connected to the system to execute this test.
3.9 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wrap around NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port. The connector wiring diagram is described in Appendix F.
3 Tests and Diagnostics 3.10 Hard Disk Test 3.10 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 01, 02, 03, 04, 05, 06, 07,09, or 10 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk.
3.10 Hard Disk Test 3 Tests and Diagnostics 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.10 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.10 Hard Disk Test Subtest 07 3 Tests and Diagnostics Read specified address This subtest reads data, which has been written to a specified cylinder and head on the HDD. Subtest 09 Sequential write This subtest writes specified 2-byte data to all of the cylinders on the HDD. Subtest 10 W-R-C specified address This subtest writes data to a specified cylinder and head on the HDD, then reads the data and compares it to the original data.
3 Tests and Diagnostics 3.11 Real Timer Test 3 3.11 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time test follow these steps: 1.
3.11 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3 Tests and Diagnostics 3.12 NDP Test 3.12 NDP Test To execute the NDP Test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.13 Expansion Test 3 Tests and Diagnostics 3.13 Expansion Test To execute the Expansion Test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 03 3.13 Expansion Test RGB monitor ID Connect a wraparound connector to CRT monitor for the test of ID acquisition. To check whether the ID is acquired or not is judged by the data from the monitor. Therefore, this test will fail when it is performed in simultaneously display mode or panel display mode. Make sure the CRT used for this test is the one with ID and only the CRT is selected for display device before the test.
3.14 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.14 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM Test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: To execute the CD-ROM/DVD-ROM test, make sure the CD-ROM and CD-ROM drive or DVD-ROM and DVD-ROM drive is installed in the computer. For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK (ZA1217P01/P000204190) for CD-ROM and DVD-ROM TEST DISK TSD-1 for DVD-ROM.
3 Tests and Diagnostics 3.15 LAN Test 3.15 LAN Test To execute the LAN Test, select 14 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The LAN Test contains one subtest. Subtest 01 LAN MAC ADDRESS DISPLAY This subtest reads MAC ADDRESS and displays it. Press Enter to exit.
3.16 Error Code and Error Status Names 3 Tests and Diagnostics 3.16 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.
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3 Tests and Diagnostics 3.17 Hard Disk Test Detail Status 3.17 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXX Detailed information about the hard disk test error is displayed on the screen by a four-digit number. The hard disk controller error status is composed of two bytes; the first byte displays the contents of the HDC status register in hexadecimal form and the second byte displays the HDC error register.
3.17 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector. 3 —— Not used 2 ABT (Abort) “0” … Not used “1” … Illegal command or command abort.
3 Tests and Diagnostics 3.18 3.18 Head Cleaning Head Cleaning 3.18.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.18.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.19 Log Utilities 3.19 3 Tests and Diagnostics Log Utilities 3.19.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD, HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.19 Log Utilities 3.19.2 Operations 1. Selecting 5 and pressing Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3.20 Running Test 3.20 3 Tests and Diagnostics Running Test 3.20.1 Function Description This function automatically executes the following tests in sequence: 1. 2. 3. 4. 5. 6. 7. System test (subtest 01) Memory test (subtests 01, 02 and 06) Display test (subtest 01) FDD test (subtest 02) HDD test (subtests 01) Real timer test (subtest 02) Printer test (subtest 03) if selected The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.20.
3 Tests and Diagnostics 3.20 Running Test 4. Select Yes or No and press Enter. The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s) will be destroyed] 5. This program is executed continuously. To terminate the program, press Ctrl + Break.
3.21 Floppy Disk Drive Utilities 3.21 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.21.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command. This program can format a 3.5-inch floppy disk in the following formats: (a) 2D: Double-sided, double-density, 48/67.
3 Tests and Diagnostics 3.21 Floppy Disk Drive Utilities 3.21.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3.21 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.21 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h).
3.21 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #X] ID code (h) No. of Cylinders Removable Cylinders No.
3 Tests and Diagnostics 3.22 System Configuration 3 3.22 System Configuration 3.22.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor type 2. VGA controller 3. MS-DOS version 4. BIOS ROM version (1st ID, 2nd ID) 5. Boot ROM version 6. KBC version 7. PS Micon version (EC Version) 8. Total memory size (Conventional Memory) 9. Battery code 10. Sound System 11. The number of printer ports 12. The number of ASYNC ports 13.
3.22 System Configuration 3 Tests and Diagnostics 3.22.2 Operations Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name ???] * ** * * * * * * * ** * * * * * * * * - Processor Type = XXXXXX VGA Controller = XXXXXX MS-DOS Version = V7.XX BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX KBC Version = VX.XX PS Micon Version = V1.XX ( EC Version = VX.
3 Tests and Diagnostics 3.23 3.23 SETUP SETUP 3.23.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot protocol 6. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 7.
3.23 SETUP 3 Tests and Diagnostics 13. Peripheral (a) Internal Pointing Device (b) Parallel Port Mode (c) Hard Disk Mode 14. LEGACY Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 15.
3 Tests and Diagnostics 3.23.2 3.23 SETUP Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the SETUP screen. The SETUP screen is divided into two pages. SYSTEM SETUP (1/2) ACPI BIOS version = X.
3.23 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.23 SETUP SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of option displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time This option is used to set the date and the time of the computer. Date (MM-DD-YYYY) Sets the date.
3.23 SETUP 3 Tests and Diagnostics NOTE: In boot mode, the System Auto Off (*1) item does not appear. Display of the LCD Brightness will be changed in the condition below: (*2) Operating the battery (*3) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. For details, see Battery Save Options below. (a) Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 2.66/2.80/3.06/3.
3 Tests and Diagnostics 3.23 SETUP HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1, 3, 5, 10, 15, 20 or 30 minutes. System Auto Off Use this option to disable or set the duration of the system automatic off function in Resume mode. In Boot mode, it is not displayed. Disabled Disables system automatic power off. xx Min.
3.23 SETUP 3 Tests and Diagnostics 4. Password This option sets or resets the user password for power on and instant security (Fn+F1). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
3 Tests and Diagnostics 3.23 SETUP (b) HDD Priority Use this option to set the priority for booting of the computer when a device connected via PC card is connected to the computer. Built-in HDD→PC Card: The computer looks for bootable files in the built-in HDD first. (Default) PC Card→Built-in HDD: The computer looks for bootable files in the PC card first. (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol.
3.23 SETUP 3 Tests and Diagnostics (b) TV Type This option allows you to select the type of TV. NTSC (Japan) TV in Japanese system NTSC (US) TV in the U.S. system (Default) PAL TV in Europe system 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. This potion can also be set by hotkeys. Boot Turns on boot mode.
3 Tests and Diagnostics 3.23 SETUP (d) Dynamic CPU Frequency mode Use this option to choose a setting from the followings. When the CPU of the computer is Celeron, this option is not displayed. Dynamically Switchable Enables Pentium 4 processor featuring Intel SpeedStep technology. (Default) Always High Disables Pentium 4 processor featuring Intel SpeedStep technology and always runs the processor at its maximum speed.
3.23 SETUP 3 Tests and Diagnostics For the Alarm Time, set the time to turn on the power automatically. The “second” cannot be set. When it is set to “Disabled”, the time to turn on automatically is not set. For the Alarm Date Option, set the date to turn on the power automatically. When it is set to “Disabled”, the time to turn on automatically is not set. The Ring Indicator is displayed only when the computer is in Resume mode and this function cannot be used for a PC card-type modem.
3 Tests and Diagnostics 3.23 SETUP 9. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the PC card. This option sets the interrupt request level and I/O port base address for the parallel port. When the parallel port mode is set to Std.
3.23 SETUP 3 Tests and Diagnostics 10. Drives I/O This option displays the address and interrupt level for the hard disk drive, CD/DVDROM drive and PC card. It is for information only and cannot be changed. Built-in HDD The setting for the built-in HDD is displayed. CD-ROM The setting for the built-in CD-ROM is displayed. PC Card This is displayed, when a PC card type HDD that can boot system is inserted to PC card slot. 11.
3 Tests and Diagnostics 3.23 SETUP (b) Parallel Port Mode Use this option to set information of ECP and Standard Bi-directional. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct. Sets the bi-directional setting. This setting should be used with some other parallel devices. NOTE: When the Windows is used, the setting in “Toshiba HW setup” has the priority. The setting in “Parallel Port Mode” is ignored.
3.23 SETUP 3 Tests and Diagnostics (b) USB-FDD Legacy Emulation This option sets the Legacy support condition of the USB floppy disk drive. Enabled Enables LEGACY support. (Default) USB floppy disk is available without the driver. To start the computer by FD, set this option to "Enabled" Disabled Disables LEGACY support 15. PCI LAN This option sets the Enable/Disable of the built-in LAN functions. Enabled Enables built-in LAN functions. (Default) Disabled Disables built-in LAN functions.
3 Tests and Diagnostics 3.24 Repair initial config set 3.24 Repair initial config set The following message will appear: #################################################################### ######### H/W initial information setting tool VerX.
3.25 Wireless LAN Test Program (Agere) 3 Tests and Diagnostics 3.25 Wireless LAN Test Program (Agere) This section describes how to perform the Agere wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Agere wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3 Tests and Diagnostics Subtest 01 3.25 Wireless LAN Test Program (Agere) Transmit & Receive test This sub test checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the target machine as a responder. The following message will appear: ############################################################### #### Wireless LAN sub system repair test VX.
3.25 Wireless LAN Test Program (Agere) 3 Tests and Diagnostics Then press Enter in the target machine; the “OK” message will appear also in the target machine. Press Enter to return to the main menu. Receive test In receive test reverse the procedures of the transmit test. To prepare the tester machine for the Wireless LAN test program, insert a floppy disk containing the test program into the floppy disk drive of the tester machine and turn on the tester machine. The Wireless LAN test menu will appear.
3 Tests and Diagnostics 3.25 Wireless LAN Test Program (Agere) Press 0 to select the test and press Enter in the target machine. The following message will appear: ############################################################## #### Wireless LAN sub system repair test VX.
3.26 Wireless LAN Test Program (Atheros 11b/g or 11a/b/g) 3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Atheros 11b/g or 11a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros 11b/g or 11a/b/g wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test. When conducting this test, make sure that any wireless network device using 2.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Atheros 11b/g or 11a/b/g) Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the floppy disk drive of the responder machine and turn on the responder machine. The wireless LAN test menu will appear.
3.26 Wireless LAN Test Program (Atheros 11b/g or 11a/b/g) 3 Tests and Diagnostics When the tester machine has passed the test, "OK" message will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" message will appear in the tester machine. Pressing Enter on the screen shows the following message. ****************************************************** * * * 8.
3 Tests and Diagnostics 3.27 Sound/LAN/Modem Test Program 3.27 Sound/LAN/Modem Test Program This section describes how to perform the Sound/LAN/Modem test with the test program. Insert the Test program disk in the floppy disk drive and turn on the power. The following message will appear: #################################################################### ######### XXXXXX DIAGNOSTICS PROGRAM (SOUND/LAN/MODEM TEST)##### #################################################################### * * * 1 .........
3.27 Sound/LAN/Modem Test Program Subtest 01 3 Tests and Diagnostics Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminals can be checked at the same time. Before executing this subtest, connect an external microphone to the computer. If necessary, connect a headphone to the computer to check whether the headphone jack of the computer is working properly. When the subtest is selected, the following message appears: ....
3 Tests and Diagnostics Subtest 02 3.27 Sound/LAN/Modem Test Program Sin Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sin wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measuring devices such as an oscilloscope, the data can be measured as a sine wave. When the subtest is executed, the following message appears: ....
3.27 Sound/LAN/Modem Test Program Subtest 04 3 Tests and Diagnostics Modem For this subtest, connect the modem PCB-RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. Select 4 to execute and press Enter. The following message will appear: ....Press test number[1-4] ? ICH_MSCE.EXE ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.28 IEEE1394 test program 3.28 IEEE1394 test program This section describes how to perform the IEEE1394 test with the test program. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: Insert the Diagnostics disk in the floppy disk drive and turn on the computer.
3.29 Thermal Radiation Control Test 3 Tests and Diagnostics 3.29 Thermal Radiation Control Test This thermal radiation control test checks the temperature of the CPU and GPU. To execute this test, use the diagnostics disk (thermal radiation control) and follow the procedures below. 1. Turn on the computer and start the Windows. 2. Insert the diagnostic disk for the thermal radiation control test to the USB FDD. 3. Open the [EXPLORE] window and double-click the [THERMAL.bat] file in the diagnostic disk. 4.
3 Tests and Diagnostics 3.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4-ii Satellite A40 Maintenance Manual (960-458)
4 Replacement Procedures Chapter 4 Contents 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card..................................................................................................................... 4-10 4.4 SD card.............................................
4 Replacement Procedures 4.26.3 Replacing the 14.1 Inch XGA TMD Fluorescent Lamp .................... 4-80 4.26.4 Replacing the 15.0 Inch XGA CHIMEI Fluorescent Lamp............... 4-92 4.26.5 Replacing the 15.0 Inch XGA LG.Philips Fluorescent Lamp............ 4-98 4.26.6 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp ............ 4-106 4.26.7 Replacing the 15.0 Inch XGA Sharp Fluorescent Lamp.................. 4-112 4.26.8 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp .....
4 Replacement Procedures Figure 4-23 Removing the LED board ............................................................................ 4-40 Figure 4-24 Removing the RTC battery .......................................................................... 4-43 Figure 4-25 Removing the sound board .......................................................................... 4-44 Figure 4-26 Removing the bat con cover ........................................................................
4 Replacement Procedures Figure 4-121 to 4-128 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp ..........4-127 to 4-132 Figure 4-129 to 4-153 15.0 Inch SXGA+ Sharp Fluorescent Lamp ..................
4.1 General 4 4 Replacement Procedures Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode. Never heat or disassemble the battery pack, as that could cause leakage of alkaline solution.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassembly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1. Do not disassemble the computer unless it is operating abnormally. 2. Use only the correct and approved tools. 3.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has three basic types of cable connectors: • • • Pressure Plate Connectors Coaxial Cable Connectors Normal Pin Connectors To disconnect a Pressure Plate connector, lift up the tabs on either side of the connector’s plastic pressure plate and slide the cable out of the connector. To connect the cable to a Pressure Plate connector, make sure the pressure plate is fully lifted and slide the cable into the connector.
4.1 General 4 Replacement Procedures Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper use of these devices will increase the success rate of your repairs and lower the cost for damaged or destroyed parts. The following equipment is necessary to disassemble and reassemble the computer: • One M2 point size 0 Phillips screwdriver to remove and replace screws. • One M2.
4 Replacement Procedures 4.1 General Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screwdriver for quick and easy operations. • M2 0.17 N·m (1.7 kgf·cm) • M2.5 0.30 N·m (3.0 kgf·cm) • M3 0.57 N·m (5.
4.1 General 4 Replacement Procedures Color of Screw Shaft To avoid mistakes on the screw length, screw shafts are colored as follows: Even number length screw: brown Odd number length screw: white Special length screw: blue Screws whose lengths are indicated to one or more decimal places such as 2.5 mm or 2.8 mm.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack. 1. Turn off the computer. 2. Disconnect the AC adapter and other external devices from the computer. 3. Turn the computer face down. 4. Release the battery lock.
4.2 Battery pack 4 Replacement Procedures Installing the Battery pack To install the battery pack, follow the steps below and refer to figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of. For environmental reasons, collect the spent battery packs. Use only batteries recommended by Toshiba as replacements. NOTE: Check the battery's terminals visually. If they are dirty, wipe them clean with a dry cloth. 1.
4 Replacement Procedures 4.3 4.3 PC card PC card Removing the PC card To remove the PC card, follow the steps below and refer to figure 4-2. CAUTION: Before you remove the PC card, refer to the card's documentation and your operating system documentation for proper procedures and precautions. 1. Turn the computer face up. 2. Push the eject button. It will pop out. 3. Press once more the eject button to eject the PC card. 4. Grasp the PC card and pull it out.
4.3 PC card 4 Replacement Procedures Installing the PC card To install the PC card, follow the steps below and refer to figure 4-2. 1. Make sure the eject button does not stick out. 2. Insert the PC card and press it until it is securely connected.
4 Replacement Procedures 4.4 4.4 SD card SD card Removing the SD card To remove the SD card, follow the steps below and refer to figure 4-3. CAUTION: Before you remove the SD card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions. 1. Push the SD card. It will pop out partly. 2. Pull out the SD card. SD card Figure 4-3 Removing the SD card Installing the SD card To install the SD card, follow the steps below and refer to figure 4-3. 1.
4.5 HDD 4.5 4 Replacement Procedures HDD CAUTION: When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. HDD Removing the HDD To remove the HDD, follow the steps below and refer to figures 4-4 and 4-5. 1. Turn the computer upside down. 2. Remove the following screw securing the HDD cover. Remove the HDD cover by lifting it up. • M2.5×4B FLAT HEAD screw ×2 M2.5×4B FLAT HEAD HDD cover M2.
4 Replacement Procedures 4.5 HDD 3. Remove the following screws and pull the tab of the HDD pack to remove it. Be careful not to damage the connector. • M2.5×4B FLAT HEAD screw ×1 NOTE: The following steps describe how to disassemble the HDD pack; however, do not disassemble if the HDD is working properly. 4. Remove the following screws. • M3×4S FLAT HEAD screw ×4 5. Detach the HDD from the HDD bracket. CAUTION: Do not apply pressure to the top and bottom of the HDD.
4.5 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to figures 4-4 and 4-5. CAUTION: Do not hold the HDD by its top and bottom. It may damage the HDD. 1. Secure the HDD to the HDD bracket with the following screws. • M3×4S FLAT HEAD screw ×4 CAUTION: Hold the HDD pack by the sides. 2. Insert the HDD pack into the slot and secure it with the following screws. • M2.5×4B FLAT HEAD screw ×1 3.
4 Replacement Procedures 4.6 4.6 Heat sink/CPU Heat sink/CPU Removing the Heat sink/CPU To remove the heat sink/CPU, follow the steps below and refer to figures 4-6 to 4-9. CAUTION: The CPU can become very hot during operation. Be sure to let it cool before starting repair work. 1. Remove the following screws securing the CPU slot cover. Remove the CPU slot cover by lifting it up. • M2.5×4B FLAT HEAD screw ×2 2. Remove the following screws securing the heat sink slot cover.
4.6 Heat sink/CPU 4 Replacement Procedures 3. Remove the following screws securing the CPU holder, in the reverse order of the number marked on the holder. • M2.5×6B FLAT HEAD screw ×3 4. Remove the CPU holder. 5. Release the lock lever (lift the lock lever vertically) and lift up the heat sink. M2.5×6B FLAT HEAD Lock lever CPU holder Heat sink Figure4-7 Removing the CPU holder and heat sink 6.
4 Replacement Procedures 4.6 Heat sink/CPU Installing the Heat sink/CPU To install the heat sink/CPU, follow the steps below and refer to figures 4-6 to 4-9. CAUTION: Place the CPU in such direction as shown below. (Pay attention to the position of the triangle mark on the CPU.) Make sure the lock lever is lifted up, before installing the CPU. 1. Seat the CPU in the CPU socket and lock the lock lever by pressing it down. Make sure the position is exact to avoid damaging pins of the CPU.
4.6 Heat sink/CPU 4 Replacement Procedures 2. Apply new grease on the CPU using a brush as shown in the following figure. Apply appropriate quantity (about 0.5 gram minimum) of grease evenly all over the top face of the CPU chip. When silicon grease is left on to the CPU chip, wipe it off with a cloth in advance. Brush Grease CPU Figure 4-9 Applying new grease 3. Install the heat sink. CAUTION: When installing the heat sink, make sure the bottom of the heat sink covers the top of the CPU. 4.
4 Replacement Procedures 4.7 4.7 Optical drive Optical drive Removing the Optical drive To remove the optical drive, follow the steps below and refer to figures 4-10 and 4-11. CAUTION: Do not apply excessive force to the top of an optical drive. 1. Turn the computer upside down. 2. Remove the following screws securing the optical drive. • M2.5×4B FLAT HEAD screw ×2 3. Pull the optical drive outward to disconnect it. M2.
4.7 Optical drive 4 Replacement Procedures 4. Remove the following screws and detach the optical drive from the plastic frame.
4 Replacement Procedures 4.7 Optical drive Installing the Optical drive To install the optical drive, follow the steps below and refer to figures 4-10 and 4-11. 1. Seat the optical drive on the plastic frame, and secure them with the following screws. • M2×3C • Stepping screw S-FLAT HEAD screw ×2 ×1 2. Insert the optical drive into the slot to connect it. 3. Secure the optical drive with the following screws. • 4-22 M2.
4.8 Keyboard 4.8 4 Replacement Procedures Keyboard CAUTION: When removing/installing the keyboard, do not touch the memory module, boards and speakers under the keyboard. It may cause the damages to them. Removing the Keyboard To remove the keyboard, follow the steps below and refer to figures 4-12 and 4-13. 1. Turn the computer face up and open the display. 2. Hold the both ends of the keyboard holder and lift it up to remove. 3.
4 Replacement Procedures 4.8 Keyboard 4. Lift the upper side of the keyboard up and turn it’s face down on the palm rest. 5. Remove the following screw and keyboard support plate. • M2.5×6B FLAT HEAD screw ×1 6. Disconnect the keyboard cable from the connector PJ3200 on the system board, and remove the keyboard. Keyboard support plate PJ3200 M2.
4.8 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to figures 4-12 and 4-13. 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to the connector PJ3200 on the system board. 3. Place the keyboard support plate and secure it with the following screw. • M2.5×6B FLAT HEAD screw ×1 4. Turn the keyboard face up and set it. Make sure that there is no gap between the keyboard and the edge of palm rest. 5.
4 Replacement Procedures 4.9 4.9 Memory module Memory module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove the memory module, confirm that the computer is in boot mode.
4.9 Memory module 4 Replacement Procedures Installing the memory module To install the memory module, confirm that the computer is in boot mode. Then follow the steps below and refer to figures 4-14. 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert the memory module. Inserting a memory module with the power on might damage the module or the computer itself.
4 Replacement Procedures 4.10 4.10 Wireless LAN board/Modem Daughter Card Wireless LAN board/Modem Daughter Card 4.10.1 Wireless LAN board CAUTION: The power must be turned off when you remove the wireless LAN board. Removing the wireless LAN board with the power on risks damaging the board or the computer itself. Never press hard or bend the wireless LAN board. Removing the wireless LAN board To remove the wireless LAN board, follow the steps below and refer to figure 4-15 and 4-16. 1.
4.10 Wireless LAN board/Modem Daughter Card 4 Replacement Procedures 3. Peel off the glass tape and disconnect the two wireless LAN antenna cables (black and white) from the wireless LAN board. 4. Open the left and right latches and remove the wireless LAN board.
4 Replacement Procedures 4.10 Wireless LAN board/Modem Daughter Card Installing the wireless LAN board To install the wireless LAN board, follow the steps below and refer to figure 4-15 and 4-16. 1. Insert the wireless LAN board terminals slantwise into the connector on the computer and press the wireless LAN board until it is securely in place. 2. Connect the wireless LAN cables (black and white) to the terminals on the wireless LAN board and fix them with the glass tape. 3.
4.10 Wireless LAN board/Modem Daughter Card 4 Replacement Procedures 4.10.2 Modem Daughter Card CAUTION: The power must be turned off when you remove the modem daughter card. Removing the modem daughter card with the power on risks damaging the card or the computer itself. Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to figure 4-17. 1. Remove the following screws securing the modem daughter card. • M2×4Z BIND screw ×2 2.
4 Replacement Procedures 4.10 Wireless LAN board/Modem Daughter Card Installing the Modem Daughter Card To install the modem daughter card, follow the steps below and refer to figures 4-17. 1. Connect the modem cable to the connector on the modem daughter card. 2. Connect the modem daughter card to the connector PJ3000 on the system board. CAUTION: Be careful not to damage the card and connector. 3. Secure the modem daughter card with the following screws.
4.11 CD/DVD (Audio) play button 4 Replacement Procedures 4.11 CD/DVD (Audio) play button CAUTION: When removing/installing the CD/DVD (audio) play button, do not touch the speakers. It may cause any damage. Removing the CD/DVD (audio) play button To remove the CD/DVD (audio) play button, follow the steps below and refer to figure 4-18. 1. Remove the following screws fixing the CD/DVD (audio) play button. • M2.5×4B FLAT HEAD screw ×2 2.
4 Replacement Procedures 4 4.12 Display assembly Replacement Procedures 4.12 Display assembly Removing the Display assembly To remove the display assembly, follow the steps below and refer to figures 4-19 to 4-21. 1. Turn the computer upside down. 2. Remove the following screws. • M2.5×16B FLAT HEAD screw ×12 (“16” in the figure below) • M2.5×6B FLAT HEAD screw ×7 (“6” in the figure below) • M2.
4.12 Display assembly 4 Replacement Procedures 3. Turn the computer face up and open the display. 4. Remove the following screws securing the display assembly. • M2.5×6B FLAT HEAD screw ×2 5. Disconnect the LCD cable from the connector PJ5600 on the system board. 6. Disconnect the speaker cables from the connectors PJ6001 (blue) and PJ6002 (red) on the system board. 7. Disconnect the panel sensor cable from the connector PJ3302 on the system board.
4 Replacement Procedures 4.12 Display assembly 8. Remove the display assembly from the base assembly while unhooking the latches. Display assembly Figure 4-21 Removing the display assembly (3) NOTE: When removing the display assembly, be careful not to damage any cables.
4.12 Display assembly 4 Replacement Procedures Installing the Display assembly To install the display assembly, follow the steps below and refer to figures 4-19 to 4-21. 1. Install the display assembly on the base assembly. NOTE: When installing the display assembly, be careful not to pinch or damage any cables. 2. Press along the edges of the display assembly to secure the latches. 3. Connect the panel sensor cable to the connector PJ3302 on the system board. 4.
4 Replacement Procedures 4.13 Touch pad 4.13 Touch pad Removing the Touch pad To remove the touch pad, follow the steps below and refer to figures 4-22. 1. Disconnect the touch pad flexible cable from the connector PJ3260 on the system board. 2. Remove the following screws securing the touch pad. • M2.5×3B S-FLAT HEAD screw ×2 3. Remove the touch pad. M2.5×3B S-FLAT HEAD Touch pad flexible cable Touch pad PJ3260 Figure 4-22 Removing the touch pad 4.
4.13 Touch pad 4 Replacement Procedures Installing the Touch pad To install the touch pad, follow the steps below and refer to figures 4-22. 1. Connect the touch pad flexible cable to the connector on the touch pad. 2. Install the touch pad and secure it with the following screws. • M2.5×3B S-FLAT HEAD screw ×2 3. Connect the touch pad flexible cable to the connector PJ3260 on the system board.
4 Replacement Procedures 4.14 LED board 4.14 LED board Removing the LED board The following describes the procedure for removing the LED board (See Figure 4-23). 1. Remove the following screw and LED board from the system board. • M2.5×6B FLAT HEAD screw ×1 2. Disconnect the LED cable from the connector PJ9500 on the system board. 3. Disconnect the LED cable from the LED board. PJ9500 M2.
4.14 LED board 4 Replacement Procedures Installing the LED board The following describes the procedure for installing the LED board (See Figure 4-23). 1. Connect the LED cable to the LED board and to the connector PJ9500 on the system board. NOTE: When connecting the LED cable, the bent portion of the cable must be connected to the connector on the LED board. 2. Fix the LED board to the system board with the following screw. • M2.
4 Replacement Procedures 4.15 RTC battery 4.15 RTC battery WARNING: When replacing the RTC battery, be sure to use genuine batteries or replacement batteries authorized by Toshiba. Installing the wrong battery could cause a battery explosion or other damage. If the RTC battery is found abnormal, it must not be installed. Replace it with a new battery, and dispose of the old one according to the local regulations.
4.15 RTC battery 4 Replacement Procedures Removing the RTC battery To remove the RTC battery, follow the steps below and refer to figure 4-24. 1. Disconnect the RTC battery cable from the connector PJ8490 on the system board. 2. Peel the insulators and remove the RTC battery. PJ8490 Insulator RTC battery cable Insulator RTC battery Figure 4-24 Removing the RTC battery Installing the RTC battery To install the RTC battery, follow the steps below and refer to figure 4-24. 1.
4 Replacement Procedures 4.16 4.16 Sound board Sound board Removing the Sound board To remove the sound board, follow the steps below and refer to figure 4-25. 1. Disconnect the sound board I/F cable from the connector PJ9550 on the system board and from the connector on the sound board. 2. Remove the following screws securing the sound board. • M2.5×6B FLAT HEAD screw ×2 3. Remove the sound board. Sound board I/F cable PJ9550 M2.
4.16 Sound board 4 Replacement Procedures Installing the Sound board To install the sound board, follow the steps below and refer to figure 4-25. 1. Connect the sound board I/F cable to the connector on the sound board. 2. Install the sound board slantwise to fit the guide and secure it with the following screws. • M2.5×6B FLAT HEAD screw ×2 3. Connect the sound board I/F cable to the connector PJ9550 on the system board.
4 Replacement Procedures 4.17 System board/ Bat con cover 4.17 System board/ Bat con cover Removing the System board/Bat con cover To remove the system board/bat con cover, follow the steps below and refer to figures 4-26 and 4-27. 1. Remove the following screw and bat con cover. • M2.5×6B FLAT HEAD screw ×1 M2.
4.17 System board/ Bat con cover 4 Replacement Procedures 2. Remove the following screw securing the system board. • M2.5×6B FLAT HEAD screw ×1 3. Peel off the glass tape and disconnect the fan cable 1 from the connector PJ8450 on the system board. 4. Peel of the glass tape and disconnect the fan cable 2 from the connector PJ8425 on the system board. 5. Lift up the system board to remove. Glass tape System board Fan cable 2 PJ8425 Glass tape Fan cable 1 PJ8450 M2.
4 Replacement Procedures 4.17 System board/ Bat con cover Installing the System board/Bat con cover To install the system board/bat con cover, follow the steps below and refer to figures 4-26 and 27. 1. Install the system board. NOTE: When installing the system board, be careful not to pinch or damage the fan cables. 2. Connect the fan cable 2 to the connector PJ8425 on the system board and stick the glass tape. 3.
4.18 Fan 4 Replacement Procedures 4.18 Fan Removing the Fan To remove the fan, follow the steps below and refer to figure 4-28. 1. Remove the following screws securing the fan 1. • M2.5×6B FLAT HEAD screw ×2 2. Remove the fan 1. 3. Remove the following screws securing the fan 2. • M2.5×6B FLAT HEAD screw ×2 4. Remove the fan 2. Fan 1 Fan 2 M2.5×6B FLAT HEAD M2.
4 Replacement Procedures 4.18 Fan Installing the Fan To install the fan, follow the steps below and refer to figure 4-28. 1. Install the fan 2 and secure it with the following screws. • M2.5×6B FLAT HEAD screw ×2 2. Install the fan 1 and secure it with the following screws. • 4-50 M2.
4.19 Modem cable 4 Replacement Procedures 4.19 Modem cable Removing the Modem cable To remove the modem cable, follow the steps below and refer to figures 4-29. 1. Remove the RJ11 jack while unlatching the hooks. RJ11 jack Modem cable Figure 4-29 Removing the modem cable Installing the Modem cable To install the modem cable, follow the steps below and refer to figures 4-29. 1. Install the RJ11 jack while latching the hooks.
4 Replacement Procedures 4.20 Wireless LAN cover 4.20 Wireless LAN cover Removing the Wireless LAN cover To remove the wireless LAN cover, follow the steps below and refer to figure 4-30. 1. Remove the wireless LAN cover while unlatching. Wireless LAN cover Figure 4-30 Removing the wireless LAN cover Installing the Wireless LAN cover To install the wireless LAN cover, follow the steps below and refer to the figure 4-30. 1. Install the wireless LAN cover in the slot while latching.
4.21 Battery lock assembly 4.21 4 Replacement Procedures Battery lock assembly Removing the Battery lock assembly To remove the battery lock assembly, follow the steps below and refer to figures 4-31. 1. Remove the following screws securing the battery lock assembly. • M2.5×6 Tapping screw ×2 Battery lock assembly M2.5×6 Tapping screw Figure 4-31 Removing the battery lock assembly 2. Remove the battery lock assembly.
4 Replacement Procedures 4.22 Speaker 4.22 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to figures 4-32 and 4-33. 1. Peel off the insulator.
4.22 Speaker 4 Replacement Procedures 2. Remove the following screws fixing the speakers. • M2.5×6 Tapping screw ×4 M2.5×6 Tapping M2.5×6 Tapping Speaker Speaker Figure 4-33 Removing the speakers 3. Take out the speakers from the slots and the cables from the guides/holes.
4 Replacement Procedures 4.22 Speaker Installing the Speaker To install the speaker, follow the steps below and refer to figures 4-32 to 4-34. 1. Set both the speakers in the slot and pass the cables through the hole and guide. Left Speaker cable Figure 4-34 Installing the left speaker cable 2. Secure the following screws to fix the speakers. • M2.5×6 Tapping screw ×4 3. Stick the insulator in place.
4.23 Display mask/LCD unit/FL inverter 4.23 4 Replacement Procedures Display mask/LCD unit/FL inverter Removing the Display mask/LCD unit/FL inverter The following describes the procedure for removing the display mask, LCD unit and FL inverter (See Figure 4-35 to 4-37). 1. Peel off two mask seals and remove the following screws. • M2.5×6B FLAT HEAD screw x2 2. Insert your finger between the upper edge of the display mask and the LCD, and remove the display mask while unlatching the display mask.
4 Replacement Procedures 4.23 Display mask/LCD unit/FL inverter 3. Remove the following screw fixing the FL inverter. • M2×5C S-FLAT HEAD screw x1 4. Peel off the insulator adhered to the FL inverter. 5. Disconnect the FL cable under the insulator and HV cable from the FL inverter. 6. Remove the following screws fixing the LCD unit. • M2×5C S-FLAT HEAD screw x4 7. With the bottom edge of the LCD unit on the display cover, lift the top edge of the LCD unit. 8.
4.23 Display mask/LCD unit/FL inverter 4 Replacement Procedures 9. Remove the following screws and right and left LCD supports from the LCD unit.
4 Replacement Procedures 4.23 Display mask/LCD unit/FL inverter Installing the Display mask/LCD unit/FL Inverter The following describes the procedure for installing the display mask, LCD unit and FL inverter (See Figure 4-35 to 4-37). 1. Fix the LCD supports (left and right) to the LCD unit with the following screws. • M2×3C S-FLAT HEAD screw x4 NOTE: The shape of the right LCD support for 14.1-inch LCD is different from the one of the left. Check “R” (right) or “L” (left) marks on the LCD support.
4.24 LCD cable/Sensor switch/Wireless LAN antenna 4 Replacement Procedures 4.24 LCD cable/Sensor switch/Wireless LAN antenna Removing the LCD cable/Sensor switch/Wireless LAN antenna To remove the LCD cable/sensor switch/wireless LAN antenna, follow the steps below and refer to figures 4-38 to 4-43. 1. Remove the following screws and LCD cable holder on the back. • M2.5×4 Tapping screw ×2 M2.5×4 Tapping LCD cable holder Figure 4-38 Removing the LCD cable holder 2.
4 Replacement Procedures 4.24 LCD cable/Sensor switch/Wireless LAN antenna 3. Remove the hinge cap (at the LCD cable side). 4. Pull out the LCD cable from the hole. 5. Remove the sensor switch while unhooking the latches. Hinge cap Sensor switch Figure 4-40 Removing the hinge cap (on the LCD cable side) and sensor switch 6. Peel off the acetate tape on the back and take out the sensor switch cable from the guide and hole.
4.24 LCD cable/Sensor switch/Wireless LAN antenna 4 Replacement Procedures 7. Remove the hinge cap (on the other side). Hinge cap Figure 4-42 Removing the hinge cap (on the other side) 8. Peel off the five acetate tapes on the front (figure4-43) and one acetate tape (figure4-41) on the back fixing the wireless LAN antenna cable. 9. Peel off both the wireless LAN antennas and pull out the cables through the hole under the hinge cap.
4 Replacement Procedures 4.24 LCD cable/Sensor switch/Wireless LAN antenna Installing the LCD cable/Sensor switch/Wireless LAN antenna To install the LCD cable/sensor switch/wireless LAN antenna, follow the steps below and refer to figures 4-38 to 4-43. 1. Stick the wireless LAN antennas. 2. Pass the wireless LAN antenna cables through the hole. 3. Secure the wireless LAN antenna cables with the six acetate tapes (one tape at the back, five tapes at the front). 4.
4.25 Hinge 4 Replacement Procedures 4.25 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to figures 4-44 to 4-47. 1. Remove the following screws. • M2.5×6 Tapping screw ×2 • M2.5×4B FLAT HEAD screw ×2 M2.5×6 Tapping M2.5×4B FLAT HEAD M2.
4 Replacement Procedures 4.25 Hinge 2. Peel off the insulator and remove the following screws and hinge while turning it. • M2.5×6 Tapping screw ×2 M2.5×6 Tapping Figure 4-45 Removing the hinge (1) 3. Remove the following screws and hinge while turning it. • M2.5×6 Tapping screw ×2 M2.
4.25 Hinge 4 Replacement Procedures 4. Pull out the LCD latch hook. 5. Remove the LCD latch knob. LCD latch knob LCD latch hook Figure 4-47 Removing the LCD latch hook and LCD latch knob NOTE: Be careful not to lose the spring.
4 Replacement Procedures 4.25 Hinge Installing the Hinge To install the hinge, follow the steps below and refer to figures 4-37 to 4-45. 1. Install the LCD latch knob and LCD latch hook. Be careful not to lose the spring. 2. Set both the hinges on the base side and secure them with the following screws. • M2.5×6 Tapping screw ×4 3. Secure the hinges on the display cover with the following screws. 4-68 • M2.5×4B FLAT HEAD screw ×2 • M2.
4.26 Fluorescent lamp 4 Replacement Procedures 4 4.26.8 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To disassemble the 15.0 inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-121 to 4-124. 1.
4 Replacement Procedures 4.26 Fluorescent lamp 2. Remove the top case. Be careful not to apply excessive force to the top case or gate TCP. Top case Figure 4-122 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (2) 3. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape.
4.26 Fluorescent lamp 4 Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assembly bottom (L). 1) Remove the board assembly. NOTE: This process should be made in a clean room to prevent scratch or particle on polarizer or B/L assembly. 2) Remove the adhesive tape fixing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch on the surface of each sheet.
4 Replacement Procedures 4.26 Fluorescent lamp Assembling the 15.0 Inch SXGA+ LG.Philips Fluorescent lamp To assembling the 15.0 inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-125 to 4-128. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly. 1) Remove the protect sheet from the cover assembly bottom (L). 2) Secure the cover assembly bottom (L) with the two screws. NOTE: Maximum value of torque is 2.0kg•cm.
4.26 Fluorescent lamp 4 Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-126 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (6) 3. Install the top case. Be careful not to apply excessive force to the gate TCP. Top case Figure 4-127 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.26 Fluorescent lamp 4. Stick the out side tape and cover shield. 1) Install the tape shield and adhesive tape to fix the top case. Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). Be careful not to apply excessive force to the control PCB. CAUTION: Wear anti-static gloves to prevent circuit damage caused by ESC. 3) Install the cover shield (G). Be careful not to apply excessive force to the gate TCP.
4.26 Fluorescent lamp 4 Replacement Procedures 4.26.9 Replacing the 15.0 Inch SXGA+ Sharp Fluorescent lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0-inch SXGA+ Sharp Fluorescent lamp To disassemble the 15.0 inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to Figures 4-129 to 4-138. 1.
4 Replacement Procedures 4.26 Fluorescent lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.1kg•cm Screw Screw Screw Screw Figure 4-130 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (2) 3. Turn the LCD module face up and remove the bezel (E). (E) Bezel (3) Release the hook of the bezel from the lamp cover. < Side view > Hook (1) Release the bezel from the four latches of the lamp cover. (2) Release the two latches on the P-chassis. Figure 4-131 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 4. Turn the LCD module face down. Remove four screws fixing the board and remove the FPC (G). Open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 0.9kg•cm Screw Screw Screw Open the cap of the connector and remove the FPC. (G) FPC Screw Figure 4-132 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (4) Do not hold the edge. Do not hold the edge. Raise the board and make this condition.
4 Replacement Procedures 4.26 Fluorescent lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). NOTE: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (I) LCD panel (H) Backlight unit Figure 4-134 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (6) 6. Turn the backlight unit (H) removed face down and remove two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets.
4.26 Fluorescent lamp 4 Replacement Procedures 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: The light guide and sheets are reused. Be careful not to scratch or soil them. Do not remove the reflection sheet under the light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Figure 4-136 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (8) 8. Remove the four double-sided tapes (N, O, P, Q).
4 Replacement Procedures 4.26 Fluorescent lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis (R) Lamp unit Figure 4-138 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures Assembling the 15.0 Inch SXGA+ Sharp Fluorescent Lamp To assemble the 15.0 inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to Figures 4-139 to 4-153. 1. Stick four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis (P) Do not make the P-chassis over this line. (N) 0 to 1 mm (Q) (O) Figure 4-139 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. P-chassis (R) Lamp unit Figure 4-140 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (12) NOTE: When install the lamp unit, be careful not to bend or damage the reflection sheet. Z Z Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove.
4.26 Fluorescent lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws(D). (J) Lamp cover (D) Screw (D) Screw Screw tightening torque: 0.9kg•cm Figure 4-142 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 4. Install the light guide (M) on the backlight unit. Insert the light guide straight not to deform the reflector. Backlight unit (M) Light guide Figure 4-143 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (15) 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide (M). (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Make sure there is no dust or scratch.
4.26 Fluorescent lamp 4 Replacement Procedures 6. Place the LCD panel (I) on the backlight unit (H). NOTE: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others, which has no remaining of paste. (I) LCD panel (H) Backlight Guide rib Guide rib Guide rib Guide rib unit Make sure the LCD panel installed in the guide rib surely. is Figure 4-145 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 7. Bend the TCP attaching to the source board and secure it with two screws. Then bend the TCP attaching to the gate board with two screws and insert the FPC (G) into the connector of the source board. Do not hold the edge. Do not hold the edge. Figure 4-146 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (18) Check the condition after mating. *Check the condition of the concave portion of the FPC and the outline of the connector.
4.26 Fluorescent lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover. Attach four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. < Side view > Hook (Lamp cover side) (2) Lean the bezel on the lamp cover without interference with the TCP. Figure 4-148 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (20) Make sure of mating of the bezel and the rib of the P-chassis.
4 Replacement Procedures 4.26 Fluorescent lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-150 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (22) 10. Stick the protection cover G (B). Outline standard for the gate board (B) Protection cover G Figure 4-151 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 11. Stick the protection cover S (A), fixing tape (C), fixing tape for lead wire (D). Stick to the side of the bezel. Fit the cover according to the outline of the screw. Fit the cover according to the outline of the screw. (A) Make sure the lead wire is closely attached to the bezel. 0 to 1 mm (C) (D) Stick the fixing tape at the center of the module. Do not make the tape over the top of the module. 0 to 0.
4 Replacement Procedures 4.26 Fluorescent lamp Make sure the edge of plastic resin is between ± 0.5. Edge of plastic resin 0 to 1 mm 0 to 1 mm Standard for the outline of board Standard for the outline of screw (left and right) Figure 4-153 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 4 4.26.4 Replacing the 15.0 Inch XGA CHIMEI Fluorescent lamp Disassembling the 15.0 Inch XGA CHIMEI Fluorescent lamp To disassemble the 15.0 inch XGA CHIMEI fluorescent lamp, follow the steps below and refer to figures 4-75 to 4-80. 1. Remove the CU tape, yellow tape and protector film X. Protector film X Tape CU tape Figure 4-75 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 2. Remove the two screws (B) fixing the X-PCB. Then remove the eight screws (C) fixing the metal frame. Release the two hooks (A). (B) Screw Screw (B) (A) hook (C) (C) (C) (C) Detail (A) (C) Screw (C) (C) (A) hook (C) Figure 4-76 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 3. Release the latch. NOTE: Remove the metal frame parallel not to damage it. Latch Metal frame Backlight Figure 4-77 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 4. Remove the X-PCB. When removing the X-PCB, be careful not to damage the TCP. X-PCB Panel Back light unit Figure 4-78 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 5. Remove the three spacers from the BEFIII-M diffuser sheet. Remove the DEFIII-M diffuser sheet, BEFIII-T diffuser sheet and two tapes from the backlight unit in order. When removing the sheets, be careful not to damage them. BEFIII-M diffuser sheet BEFIII-T diffuser sheet Spacer Diffuser sheet LGP Backlight unit Reflector sheet Tape Tape Figure 4-79 Replacing 15.0 Inch CHIMEI fluorescent lamp (XGA) (5) 6. Remove the two screws.
4.26 Fluorescent lamp 4 Replacement Procedures Assembling the 15.0 Inch XGA CHIMEI fluorescent lamp To assemble procedure of the 15.0 inch XGA CHIMEI fluorescent lamp, follow the reverse steps of the disassembling steps above.
4 Replacement Procedures 4.26 Fluorescent lamp 4.26.5 Replacing the 15.0 Inch XGA LG.Philips Fluorescent lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0 Inch XGA LG.Philips Fluorescent lamp To disassemble the 15.0 inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-81 to 4-84. 1.
4.26 Fluorescent lamp 4 Replacement Procedures 2. Remove the top case. Be careful not to apply excessive force to the top case and gate TCP. Top case Figure 4-82 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.26 Fluorescent lamp 3. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape. S ou rce P C B G a te P C B Figure 4-83 Replacing 15.0 Inch LG.
4.26 Fluorescent lamp 4 Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assembly bottom (L). 1) Remove the board assembly. 2) Remove the adhesive tape securing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch the sheets. 4) Remove the screw and cover assembly bottom (L). NOTE: Maximum value of torque is 1.5kg•cm.
4 Replacement Procedures 4.26 Fluorescent lamp Assembling the 15.0-inch XGA LG.Philips Fluorescent lamp To assemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-85 to 4-88. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly. 1) Remove the protect film from the cover assembly bottom (L). 2) Secure the cover assembly bottom (L) with the two screws. NOTE: Maximum value of torque is 2.0kg• cm.
4.26 Fluorescent lamp 4 Replacement Procedures NOTE: Do not apply excessive force to the PCB and TCP. Board assembly Adhesive tape Double-sided tape Adhesive tape Double-sided tape Double-sided tape Double-sided tape Adhesive tape Adhesive tape Sheets and LGP Screw Cover assembly bottom (L) Screw Figure 4-85 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.26 Fluorescent lamp 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-86 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (6) 3. Install the top case. Be careful not to apply excessive force to the gate TCP. Top case Figure 4-87 Replacing 15.0 Inch LG.
4.26 Fluorescent lamp 4 Replacement Procedures 4. Stick the outside tape and install the cover shield. 1) Stick the tape shield and adhesive tape to fix the top case. NOTE: Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). NOTE: Be careful not to apply excessive force to the control PCB. CAUTION: Wear anti-static gloves to prevent circuit damage to the source PCB. 3) Install the cover shield (G). NOTE: Be careful not to apply excessive force to the gate TCP.
4 Replacement Procedures 4.26 Fluorescent lamp 4.26.6 Replacing the 15.0 Inch XGA Samsung Fluorescent lamp Disassembling the 15.0 Inch XGA Samsung Fluorescent lamp To disassemble the 15.0 inch XGA Samsung fluorescent lamp, follow the steps below and refer to figures 4-89 to 4-97. 1. Remove the PCB cover. NOTE: When removing the PCB cover, be careful not to damage the COF. PCB cover Figure 4-89 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 2. Remove the two screws. Screw Screw Figure 4-90 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (2) 3. Remove the four screws from the top chassis. Screw Screw Screw Screw Figure 4-91 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 4. Remove the four bottom hooks and four side hooks (left and right). Then remove the top chassis from the mold frame. S id e h o o k S id e h o o k B o tto m h o o k Figure 4-92 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (4) 5. Remove the panel assembly from the mold frame. NOTE: When removing the panel assembly, be careful not to damage the COF. P a n el a ssem b ly M old fra m e Figure 4-93 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 6. Remove the sheets and clips. 1) Remove the two clips fixing the sheets. 2) Remove the sheets (protection sheet, prism sheet (L, U), diffusion sheet, LGP and reflection sheet). C lip C lip S h e e ts Figure 4-94 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (6) 7. Remove the lamp back cover. 1) Remove the two screws from the lamp back cover. 2) Remove the lamp back cover. S crew Lam p back cover S crew Figure 4-95 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 8. Remove the lamp wire from the wire guide of the mold frame. L am p w ire Figure 4-96 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (8) 9. Remove the lamp assembly from the mold frame. Lamp assembly Mold frame Figure 4-97 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures Assembling the 15.0-inch XGA Samsumg Fluorescent lamp The assembly procedure of the 15.0-inch XGA Samsung fluorescent lamp is the reverse of the above disassembly procedure.
4 Replacement Procedures 4.26 Fluorescent lamp 4.26.7 Replacing the 15.0 Inch XGA Sharp Fluorescent lamp Disassembling the 15.0 Inch XGA Sharp Fluorescent lamp To disassemble the 15.0-inch XGA Sharp fluorescent lamp, follow the steps below and refer to figures 4-98 to 4-107. 1. Turn the LCD module face down, and remove the protection cover S (A), protection cover G (B), fixing tape (C) and fixing tape for lead wire (D). NOTE: 1) Be careful not to damage the TCP or chips.
4.26 Fluorescent lamp 4 Replacement Procedures 2. Remove the four screws on the sides. Screw loosening torque: 1.2kg•cm Screw Screw Screw Screw Figure 4-99 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (2) 3. Turn the LCD module face up and remove the bezel (E). (E) Bezel (3) Release the hook of the bezel from the lamp cover. < Side view > Hook (1) Release the bezel from the four latches of the lamp cover. (2) Release the two latches (left and right) on the P-chassis. Figure 4-100 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 4. Turn the LCD module face down and remove the two screws fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 1.2kg•cm Screw Screw Figure 4-101 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (4) Do not hold the edge. Do not hold the edge. Raise the board and make this condition. Figure 4-102 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (I) LCD panel (H) Backlight unit Figure 4-103 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 6. Turn the backlight unit (H) removed face down and remove the two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets. (H) Backlight unit Screw loosening torque: 1.2kg•cm (D) Screw (D) Screw (J) Lamp cover Figure 4-104 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: Be careful not to scratch or soil the removed sheets or light guide to reuse them. Do not remove the reflection sheet under the light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Figure 4-105 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (8) 8. Remove the four double-sided tapes (N, O, P, Q).
4 Replacement Procedures 4.26 Fluorescent lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis Lamp unit (R) Figure 4-107 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedures Assembling the 15.0 Inch XGA Sharp Fluorescent Lamp To assemble the 15.0 Inch Sharp XGA fluorescent lamp, follow the steps below and refer to figures 4-108 to 4-120. 1. Stick the four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis (P) Do not make the P-chassis over this line. (N) 0 to 1 mm (Q) (O) Figure 4-108 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. NOTE: When install the lamp unit (R), be careful not to bend or damage the reflection sheet. P-chassis (R) Lamp unit Figure 4-109 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (12) Z Z Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove.
4.26 Fluorescent lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws (D). (J) Lamp cover Screw tightening torque: 1.0kg•cm (D) Screw (D) Screw Figure 4-111 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (14) 4. Install the light guide (M) on the backlight unit. Insert the light guide straight not to deform the reflector. Backlight unit (M) Light guide Figure 4-112 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide(M). (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Make sure there is no dust or scratch. Do not make any sheet over the edge of P-chassis. Figure 4-113 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (16) 6. Place the LCD panel (I) on the backlight unit (H). NOTE: Make sure there is no dust between the LCD panel and backlight unit.
4.26 Fluorescent lamp 4 Replacement Procedures 7. Bend the TCP attaching to the source board and secure it with the two screws. Do not hold the edge. Do not hold the edge. Figure 4-115 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (18) Screw Screw Figure 4-116 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 8. Install the bezel (E) on the lamp cover and hook the four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. < Side view > Hook (Lamp cover side) (2) Lean the bezel on the lamp cover without interference with the TCP. Figure 4-117 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (20) Make sure of mating of the bezel and the rib of the P-chassis.
4.26 Fluorescent lamp 4 Replacement Procedures 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-119 Replacing 15.
4 Replacement Procedures 4.26 Fluorescent lamp 10. Stick the protection cover G (B), protection cover S (A), fixing tape (C) and fixing tape for lead wire (D). Fit the cover according to the outline of the screw. (A) (C) (D) 0 to 0.5 mm (B) 0 to 1 mm Do not make the tape over the top of the module. The tape MUST NOT appear on the display. Stick the tape according to the outline of the LCD module. Make sure the tape does not appear on the side of the module. Figure 4-120 Replacing 15.
4.26 Fluorescent lamp 4 Replacement Procedure 4 4.26 Fluorescent lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type 14.1 inch (XGA) 15.0 inch (XGA) 15.0 inch (SXGA+) Part No. Supplier Section VF2093P01 Chimei 4.26.1 VF2058P01 Samsung 4.26.2 G33C00015110 TMD 4.26.3 G33C0000M110 Chimei 4.26.4 G33C0000K110 LG.Philips 4.26.5 G33C0000L110 Samsung 4.26.
4 Replacement Procedure 4.26 Fluorescent lamp 4.26.1 Replacing the 14.1 Inch XGA CHIMEI Fluorescent lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-48 to Figure 4-54). 1. Remove the tapes, labels and films (1 to 8). Figure 4-48 Replacing 14.1 Inch CHIMEI fluorescent lamp (1) 2. Remove the latch. Figure 4-49 Replacing 14.
4.26 Fluorescent lamp 4 Replacement Procedure 3. Remove the screw and PCB cover. Figure 4-50 Replacing 14.1 Inch CHIMEI fluorescent lamp (3) 4. Loosen the X-PCB connector and disconnect the FPC from the Y-PCB. 5. Remove the X-PCB and Y-PCB. Figure 4-51 Replacing 14.
4 Replacement Procedure 4.26 Fluorescent lamp 6. Remove the spacer from the protector sheet. 7. Remove the sheets (2) to (5). Figure 4-52 Replacing 14.1 Inch CHIMEI fluorescent lamp (5) 8. Remove the LGP and reflection sheet. Figure 4-53 Replacing 14.
4.26 Fluorescent lamp 4 Replacement Procedure 9. Remove the screw. Figure 4-54 Replacing 14.1 Inch CHIMEI fluorescent lamp (7) 10. The assembly procedure is the reverse of the above disassembly procedure.
4 Replacement Procedure 4.26 Fluorescent lamp 4.26.2 Replacing the 14.1 Inch XGA Samsung Fluorescent lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-55 to Figure 4-62) 1. Remove the PCB cover and tapes from the LCD module. Be careful not to damage the PCB. Figure 4-55 Replacing 14.
4.26 Fluorescent lamp 4 Replacement Procedure 2. Remove two screws fixing the PCB. Be careful not to damage the PCB. Screw Screw Figure 4-56 Replacing 14.
4 Replacement Procedure 4.26 Fluorescent lamp 3. Remove the metal bezel from the plastic chassis by detaching the top hooks, side hooks and bottom hooks. Figure 4-57 Replacing 14.1 Inch Samsung fluorescent lamp (3) 4. Remove the panel from the backlight unit. Be careful not to damage the TCP. Panel Backlight Unit Figure 4-58 Replacing 14.
4.26 Fluorescent lamp 4 Replacement Procedure 5. Remove two clips. Remove the sheets (lens sheet, diffusion sheet, light guide and reflection sheet). Figure 4-59 Replacing 14.1 Inch Samsung fluorescent lamp (5) 6. Remove two screws fixing the lamp cover and remove the lamp cover. Screw Screw Figure 4-60 Replacing 14.
4 Replacement Procedure 4.26 Fluorescent lamp 7. Remove the GND cable of the FL lamp from the plastic chassis. GND cable Hot wire Figure 4-61 Replacing 14.
4.26 Fluorescent lamp 4 Replacement Procedure 8. Remove the lamp unit from the plastic chassis and replace the lamp with a new one. Lamp ASSY Figure 4-62 Replacing 14.1 Inch Samsung fluorescent lamp (8) 9. The assembly procedure is the reverse of the above disassembly procedure.
4 Replacement Procedure 4.26 Fluorescent lamp 4.26.3 Replacing the 14.1 Inch XGA TMD Fluorescent lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-63 to Figure 4-74) Disassembling Fluorescent lamp Peeling off the tapes and insulation sheets 1. Flip the module over and place it on a flat surface that is free of foreign objects. 2.
4.26 Fluorescent lamp 4 Replacement Procedure Removing the screws 1. Spread out the insulation sheet without detaching it from the side of the bezel, as shown in Figure 4-46. 2. In the order (1) and (2) shown in Figure 4-64, remove the screws from the left- and right-hand sides of the module. CAUTION: To unfasten the screws, use an insert bit of point size 0 for Philips screwdrivers.
4 Replacement Procedure 4.26 Fluorescent lamp Removing the bezel 1. Without removing the insulation tape, flip the module over again so that the display screen can face up. 2. Release the latches of the bezel and frame. (On the sides, there are five latches in the upper area and two latches in the lower area.) 3. Gently remove the double-sided tape from the cell at the reverse side of the bottom of the bezel and remove the bezel. 4.
4.26 Fluorescent lamp 4 Replacement Procedure Opening the PCB 1. Spread out the PCB horizontally, as shown in Figure 4-66. CAUTION: Be careful not to damage the TAB. Open the X-PCB fromら開 theくreverse side.
4 Replacement Procedure 4.26 Fluorescent lamp Removing the PCB-assembly cell 1. Remove the cell of the PCB assembly from the backlight assembly, as indicated by (1) in Figure 4-67. Completely remove the double-sided tape remaining on the reverse side of the cell. CAUTION: On the cell, three areas are bonded to the frame with the double-sided tape (as shown in Figure 4-67, one area is at the top, and two areas are at the bottom of both sides). Remove the cell gently, taking care not to damage it.
4.26 Fluorescent lamp 4 Replacement Procedure Assembling Fluorescent lamp Putting the double-sided tapes on the bezel Reverse side of the bezel ベゼル裏面 +0 .2 （テープ幅 ） 0 (tape width) The end of tape must not go beyond the テープ端がベゼル開口部よ り opening of bezel. 越えない こ と Requirements for attaching double–sided tape 両面テープ貼 り規格 Tape must not go ベゼル開口部よ beyondり the opening テープのはみ出 し無き こ と of the bezel.
4 Replacement Procedure 4.26 Fluorescent lamp Checking the backlight 1. Inspect the replacement backlight according to Figure 4-69. The frame must not be overlaid with the prism プ リズムシー sheet, etc.ト類が フレームに 乗 り上げていない こ と 。 The frame must not be overlaid withプthe prism リズムシー ト類が フレームに sheet, etc. 乗 り上げていない こ と 。 The sheet must not be dislocated from the frame. シー トが フレームか らはずれていない こ と 。 Sheet retaining tape シー ト押えテープ Align the tape withフレームの the リブに突 rib of frame. きあてて貼る The frame must not be overlaid.
4.26 Fluorescent lamp 4 Replacement Procedure Assembling PCB-assembly cell 1. Remove the paper (coated with a mold release) from the double-sided tape in the three areas on the replacement backlight unit. The areas are at the top and on both sides. See Figure 4-70. 2. Turn the backlight on. 3. Check that the backlight is free of dust, foreign objects, or damage. Perform this check also for the reverse side of the cell. Then install the cell of the PCB assembly in the backlight unit.
4 Replacement Procedure 4.26 Fluorescent lamp Folding down and temporary fixing of the TAB/PCB 1. Fold down the TAB (PCB) toward the reverse side of the backlight unit, as shown in Figure 4-71. CAUTION: Be careful not to damage the TAB. For the X-PCB toward the り曲げ reverse Ｘ ＰＣＢを裏面に折 ． side.
4.26 Fluorescent lamp 4 Replacement Procedure Setting the bezel 1. Start installing the bezel in the upward direction until it stops at the top left corner. CAUTION: The GND-CU and lamp reflector on the left-hand side must not go beyond the edges of the bezel. Be careful not to damage the cables and TAB. The bezel latches must be engaged (there are five latches on the top edge, and two latches on the bottom edge). 2 2 2 Next, fit 次にた the bezel’s edge Ｔ ＡＢ側をはめる ． close to the TAB.
4 Replacement Procedure 4.26 Fluorescent lamp Fasten screws of the PCB and bezel 1. Fasten four screws on the left edge in the order (5), (6), (7), and (8) shown in Figure 4-73. 2. Fasten four screws on the right edge in the order (1), (2), (3), and (4) shown in Figure 4-73. CAUTION: Fasten the screws in the orders shown in Figure 4-73. No loose fastening is allowed. The tightening torque must not exceed 0.147Ｎ･m (1.5kgf･cm) for all the eight screws.
4.26 Fluorescent lamp 4 Replacement Procedure Attaching the tapes and insulation sheet 1. Attach the PCB insulation sheet (one point). 2. Attach the tape for the bezel to the bottom area close to the lamp (two points). 3. Attach the tape for fixing the FL tube cable (one point). CAUTION: When attaching tape and insulation sheet, be careful not to damage the TAB and lamp cable connections. Attaching insulation 絶縁シー ト貼the り付け sheet 1 1 Attach トのたわみ無き the sheet after removing 絶縁シー よ う貼 り付ける ．slack.
Appendices
Appendices App-ii Satellite A40 Maintenance Manual (960-458)
Appendices Appendix Contents Appendix A Handling the LCD Module .......................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 B.1 System Board FLM1M* Front View .................................................................... B-1 B.2 System Board FLM1M* Back View..................................................................... B-3 B.
Appendices C.21 W8800 DC-IN connector (4-pin) ........................................................................C-16 C.22 PJ8810 1st Battery connector (10-pin)................................................................C-16 C.23 PJ8490 RTC Battery Connector (3-pin)..............................................................C-16 C.24 PJ8450 FAN1 connector (3-pin) .........................................................................C-17 C.25 PJ8425 FAN2 connector (3-pin) .............
Appendices Figures Figure B-1 System board FLM1M* layout (front) ............................................................ B-1 Figure B-2 System board FLM1M* layout (back) ............................................................ B-3 Figure B-3 Sound board FLM1S* layout .......................................................................... B-5 Figure B-4 LE Board FLM1L* layout ...............................................................................
Appendices Tables Table B-1 System board FLM1M* ICs and connectors (front) ........................................B-2 Table B-2 System board FLM1M* ICs and connectors (back).........................................B-4 Table B-3 Sound board FLM1S* ICs and connectors.......................................................B-5 Table B-4 LE Board FLM1L* ICs and connectors ...........................................................B-6 Table C-1 Memory connector (200-pin).................................
Appendices Table C-25 FAN2 connector (3-pin) ................................................................................ C-17 Table C-26 LE Board I/F connector (13-pin) ................................................................... C-17 Table C-27 SD Board I/F connector (30-pin)................................................................... C-18 Table C-28 CD Board I/F connector (10-pin) ..................................................................
Appendices App-viii Satellite A40 Maintenance Manual (960-458)
Appendix A Handling the LCD Module Appendix A Appendices P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. CRT Cleaner 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module Satellite A40 Maintenance Manual (960-458)
Appendix B Board Layout Appendices Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board FLM1M* ICs and connectors (front) B-2 Mark Number Name (A) PJ1440 Memory slot (B) PJ1420 Memory slot (C) PJ3200 Keyboard I/F connector (D) PJ6001 Speaker connector (Right) (E) PJ6002 Speaker connector (left) (F) PJ8450 Fan connector 1 (G) PJ9500 LE board I/F connector (H) PJ8490 RTC battery connector (I) PJ9550 SD board I/F connector (J) PJ3203 Debugging connector (K) PJ3302 Sensor switch connector (L) PJ9600
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board FLM1M* ICs and connectors (back) B-4 Mark Number Name (A) PJ4100 Network I/F connector (B) PJ4601 USB port 2/3 connector (C) Reserved (D) PJ4200 IEEE1394 I/F connector (E) PJ3510 Parallel port I/F connector (F) PJ5620 CRT connector (G) PJ4600 USB port 0/1 connector (H) PJ1801 HDD I/F connector (I) PJ1800 CD-ROM I/F connect (J) PJ8810 Main Battery connector (K) PJ2110 PC card I/F connect (L) IS1050 CPU socket (
Appendix B Board Layout B.
Appendices B.
Appendix C Pin Assignment Appendices C Appendix C Pin Assignment System Board C.1 PJI1420/PJ1440 Memory connector (200-pin) Table C-1 Memory connector (200-pin)(1/4) Pin No. Signal name I/O Pin No.
Appendices Appendix C Pin Assignment Table C-1 Memory connector (200-pin)(2/4) Pin No. C-2 Signal name I/O Pin No.
Appendix C Pin Assignment Appendices Table C-1 Memory connector (200-pin)(3/4) Pin No. Signal name I/O Pin No.
Appendices Appendix C Pin Assignment Table C-1 Memory connector (200-pin)(4/4) Pin No. C.2 Signal name I/O Pin No. Signal name I/O 195 SMBCLK-P3P I/O 196 GND - 197 P3V - 198 GND - 199 N.C - 200 N.C - PJ1801 HDD I/F connector (44-pin) Table C-2 HDD I/F connector (44-pin) Pin No. C-4 Signal name I/O Pin No.
Appendix C Pin Assignment C.3 Appendices PJ1800 CD-ROM I/F connector (50-pin) Table C-3 CD-ROM I/F connector (50-pin) Pin No. Signal name I/O Pin No. Signal name I/O 1 CDAUDL-PXP I 2 CDAUDR-PXP I 3 CD-GND I 4 N.
Appendices C.4 Appendix C Pin Assignment PJ2110 PC card I/F connector (68-pin) Table C-4 PC card I/F connector (68-pin) (1/2) Pin No. C-6 Signal name I/O Pin No.
Appendix C Pin Assignment Appendices Table C-4 PC card I/F connector (68-pin) (2/2) C.5 Pin No. Signal name I/O Pin No. Signal name I/O 59 ACSERR-EYN I/O 60 ACREQ-EYN I/O 61 ACCBE3-EYN I/O 62 ACAUDI-EYP I 63 ACSTSC-EYP I 64 ACAD28-EYP I/O 65 ACAD30-EYP I/O 66 ACAD31-EYP I/O 67 ACCD2-E3N I 68 GND - PJ2130 SD card I/F connector (12-pin) Table C-5 SD card I/F connector (12-pin) Pin No. Signal name I/O Pin No.
Appendices C.6 Appendix C Pin Assignment PJ2200 Mini PCI I/F connector (124-pin) Table C-6 Mini PCI I/F connector (124-pin) (1/2) Pin No. C-8 Signal name I/O Pin No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 (WLON-S3N) O 14 N.C. - 15 GND - 16 N.C. - 17 PIRQD-P3N I/O 18 P5V - 19 P3V - 20 PIRQG-P3N 21 N.C. - 22 N.C.
Appendix C Pin Assignment Appendices Table C-6 Mini PCI I/F connector (124-pin) (2/2) Pin No. Signal name I/O Pin No.
Appendices C.7 Appendix C Pin Assignment PJ3000 MDC I/F connector (30-pin) Table C-7 MDC I/F connector (30-pin) Pin No. C-10 Signal name I/O Pin No. Signal name I/O 1 N.C - 2 GND - 3 GND - 4 N.C - 5 N.C - 6 N.C - 7 N.C - 8 GND - 9 N.C - 10 N.C - 11 N.C - 12 N.C - 13 N.C - 14 N.C - 15 GND - 16 E3V -I 17 E3V - 18 N.C - 19 GND - 20 GND - 21 N.C - 22 M97SY2-P3P I 23 M97OT2-P3P I 24 N.
Appendix C Pin Assignment C.8 Appendices PJ3200 Keyboard I/F connector (34-pin) Table C-8 Keyboard I/F connector (34-pin) C.9 Pin No. Signal name I/O Pin No.
Appendices C.10 Appendix C Pin Assignment PJ3302 Sensor Switch Connector (2-pin) Table C-10 Sensor Switch connector (2-pin) Pin No. 1 C.11 Signal name PNLOFF-S3N I/O Pin No. I 2 Signal name GND I/O - PJ3510 Parallel I/F Connector (25-pin) Table C-11 Parallel I/F connector (25-pin) Pin No. C.12 Signal name I/O Pin No.
Appendix C Pin Assignment C.13 Appendices PJ4200 1394 I/F connector (4-pin) Table C-13 1394 I/F connector (4-pin) Pin No. C.14 Signal name I/O Pin No. Signal name I/O 1 TPB0-P3N I/O 2 TPB0-P3P I/O 3 TPA0-P3N I/O 4 TPA0-P3P I/O PJ4600 USB 0/1 I/F connector (8-pin) Table C-14 USB 0/1 I/F connector (8-pin) Pin No. C.15 Signal name I/O Pin No.
Appendices C.16 Appendix C Pin Assignment PJ5600 LCD connector (40-pin) Table C-16 LCD connector (40-pin) Pin No. C-14 Signal name I/O Pin No.
Appendix C Pin Assignment C.17 Appendices PJ5620 CRT I/F connector (15-pin) Table C-17 CRT I/F connector (15-pin) Pin No. C.18 Signal name I/O Pin No. Signal name I/O 1 RED-PXP 2 GREEN-PXP 3 BLUE-PXP 4 N.C 5 GND - 6 GND - 7 GND - 8 GND - 9 (DDC-P5V) - 10 GND - 11 N.C - 12 (DDCDA) O 13 (HSYNC) O 14 (VSYNC) O 15 (DDCACK) O PJ5640 TV connector (4-PIN) Table C-18 TV connector (4-pin) C.19 Pin No. Signal name I/O Pin No.
Appendices C.20 Appendix C Pin Assignment PJ6002 Speaker Connector (Right) (2-pin) Table C- 20 Speaker Connector (right) (2-pin) Pin No. 1 C.21 Signal name I/O Pin No. O 2 SPOTR-PXP Signal Name I/O SPOTR-PXN O W8800 DC-IN connector (4-pin) Table C-21 DC-IN connector (4-pin) Pin No. C.22 Signal name I/O Pin No. Signal name I/O 1 ADPDC O 2 ADPDC O 3 GND - 4 GND - PJ8810 1st Battery connector (10-pin) Table C-22 1st Battery connector (10-pin) Pin No. C.
Appendix C Pin Assignment C.24 Appendices PJ8450 FAN1 connector (3-pin) Table C-24 FAN 1 connector (3-pin) Pin No. C.25 Signal name I/O Pin No. 2 1 FAN VCC - 3 FANG0-P3P I Signal name GND I/O - PJ8425 FAN2 connector (3-pin) Table C-25 FAN 2 connector (3-pin) Pin No. C.26 Signal name I/O Pin No. 2 1 FAN VCC - 3 FANG1-P3P I Signal name GND I/O - PJ9500 LE Board I/F connector (13-pin) Table C-26 LE Board I/F connector (13-pin) Pin No. Signal name I/O Pin No.
Appendices C.27 Appendix C Pin Assignment PJ9550 SD Board I/F connector (30-pin) Table C-27 SD Board I/F connector (30-pin) Pin No. C.28 Signal name I/O Pin No.
Appendix C Pin Assignment Appendices LE Board C.29 PJ9505 System Board I/F connector (13-pin) Table C-29 System Board I/F connector (13-pin) Pin No. Signal name I/O Pin No.
Appendices Appendix C Pin Assignment SD Board C.30 PJ9555 System Board I/F connector (30-pin) Table C-30 System Board I/F connector (30-pin) Pin No. C-20 Signal name I/O Pin No.
Appendix C Pin Assignment C.31 Appendices PJ6000 External microphone connector (5-pin) Table C-31 External microphone connector (5-pin) Pin No. C.32 Signal name I/O Pin No. Signal name I/O 1 GND - 2 (MICIN-PXP) I 3 (MMREFV-P2V) O 4 GND - 5 GND - PJ6003 Headphone connector (6-pin) Table C-32 Headphone connector (6-pin) Pin No. Signal name I/O Pin No. Signal name I/O 1 GND - 2 HEADL-PXP O 3 HEADR-PXP O 4 GND - 5 (SPKEN-P5P) I 6 N.
Appendices Appendix C Pin Assignment CD Board C.33 PJ9605 System Board I/F connector (10-pin) Table C-33 System Board I/F connector (10-pin) Pin No. C-22 Signal name I/O Pin No. Signal name I/O 1 GND - 2 N.C - 3 CDBDET-S3N I 4 N.
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Code set 1 Make Code set 2 Break Make Note Break Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E E.
Appendices E.
Appendix E Key Layout Appendices Figure E-5 US keyboard (made by NMB G83C0000E510) Satellite A40 Maintenance Manual (960-458) E-3
Appendices E-4 Appendix E Key Layout Satellite A40 Maintenance Manual (960-458)
Appendix F Wiring Diagrams Appendices Appendix F Appendix F F.1 Wiring Diagrams Parallel Port Wraparound Connector -SELECT -PINT Figure F-1 Parallel port wraparound connector F.
Appendices F-2 Appendix F Wiring Diagrams Satellite A40 Maintenance Manual (960-458)
Appendix G BIOS Rewrite Procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC card. 4.
Appendices Appendix G BIOS Rewrite Procedures G-2 Satellite A40 Maintenance Manual (960-458)
Appendix H EC/KBC Rewrite Procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBC only when instructed by a diagnostic disk release notice. 2. Connect the AC adaptor to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC Rewrite Procedures Satellite A40 Maintenance Manual (960-458)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures).
Appendices I-2 Appendix I Reliability Satellite A40 Maintenance Manual (960-458)
