Datasheet

Intel® Xeon™ Processor with 512 KB L2 Cache
Datasheet 95
6.0 Thermal Specifications
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel
®
Xeon™ processor with 512 KB L2 cache. Thermal solutions should include heatsinks that
attach to the integrated heat spreader (IHS). The IHS provides a common interface intended to be
compatible with many heatsink designs. Thermal specifications are based on the temperature of the
IHS top, referred to as the case temperature, or T
CASE
. Thermal solutions should be designed to
maintain the processor within T
CASE
specifications. For information on performing T
CASE
measurements, refer to the Intel® Xeon™ Processor Thermal Design Guidelines. See Figure 37 for
an exploded view of the processor package and thermal solution assembly.
Note: The processor is either shipped alone or with a heatsink (boxed processor only). All other
components shown in Figure 37 must be purchased separately.
Note: This is a graphical representation. For specifications, see each component’s respective
documentation listed in Section 1.3.
Figure 37. Processor with Thermal and Mechanical Components - Exploded View
EMI ground
frame
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket
EMI ground
frame
Heat sink clip
Heat sink
Retention
mechanism
603-pin
socket