Datasheet

Intel® Xeon™ Processor with 512 KB L2 Cache
Datasheet 25
2.11 Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless
noted otherwise. See Section 5.1 for the processor pin listings and Section 5.2 for the signal
definitions. The voltage and current specifications for all versions of the processor are detailed in
Table 6. For platform planning refer to Figure 3. Notice that the graphs include Thermal Design
Power (TDP) associated with the maximum current levels. The DC specifications for the AGTL+
signals are listed in Table 8.
The front side bus clock signal group and the SMBus interface signal group are detailed in Table 7
and Table 11, respectively. The DC specifications for these signal groups are listed in Table 9.
Table 6 through Table 11 list the processor DC specifications and are valid only while meeting
specifications for case temperature (T
CASE
as specified in Chapter 6.0), clock frequency, and input
voltages. Care should be taken to read all notes associated with each parameter.