Datasheet

TLP627,TLP627-2,TLP627-4
2007-10-01 2
Absolute Maximum Ratings
(Ta=25°C)
RATING
CHARACTERISTIC SYMBOL
TLP627
TLP627-2
TLP627-4
UNIT
Forward Current I
F
60 50 mA
Forward Current Derating I
F
/°C 0.7(Ta39°C) 0.5(Ta25°C) mA /°C
Pulse Forward Current I
FP
1(100μs pulse,100pps) A
Power Dissipation (1 Circuit) P
D
100 70 mW
Power Dissipation Derating (Ta25°C,1 Circuit) P
D
/°C -1.0 -0.7 mW /°C
Reverse Voltage V
R
5 V
LED
Junction Temperature Tj 125 °C
Collector-Emitter Voltage V
CEO
300 V
Emitter -Collector Voltage V
ECO
0.3 V
Collector Current I
C
150 mA
Collector Power Dissipation (1 Circuit) P
C
150(*300) 100 mW
Collector Power Dissipation Derating (Ta25°C,1 Circuit) P
c
/°C
-1.5(*-3.5) -1.0 mW /°C
DETECTOR
Junction Temperature T
j
125 °C
Operating Temperature Range T
opr
55~100 °C
Storage Temperature Range T
stg
55~125 °C
Lead Soldering Temperature (10s) T
sold
260(10sec) °C
Total Package Power Dissipation P
T
250(*320) 150 mW
Total Package Power Dissipation Derating (Ta25°C,1 Circuit) P
T
/°C -2.5(*-3.2) -1.5 mW /°C
Isolation Voltage (AC,1min. , R.H.60%) (Note1) BV
S
5000 V r m s
*IF=20mA Max
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note1)Device considered a two terminal device : LED side pins Shorted together and
DETECTOR side pins shorted
together.
Recommended Operating Conditions
CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT
Supply Voltage V
CC
— — 200 V
Forward Current I
F
16 25 mA
Collector Current I
C
— — 120 mA
Operating Temperature T
opr
25 — 85 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.