Specifications

TC6203P_D2
7 / 9
Any I/O pin
voltage
2.2
_
3.3
V
Static levels
（ HBM）
TAMB=25°C
_
_
2
KV
2.3 Module mechanical dimensions
TC6203P_D2 physical size（units：mm）：
Figure 2. TC6203P_D2 mechanical dimensions
3 operation instruction
3.1 Production guide
It is suggested to use SMT machine to patch the package module of stamp mouth, and finish
the
patch within 24 hours after the packaging is unpacked. Otherwise, it should be vacuumized
again
to avoid the bad patch caused by dampness.
If the package contains a humidity indicator card, it is recommended to judge whether the
module
needs to be baked according to the humidity indicator card. The baking conditions are as
follows:
Stoving temperature： 125℃±5℃；
Alarm temperature: 130℃；
After cooling less than 36℃ under natural conditions, SMT patch can be performed.
If the unsealing time is more than 3 months, special attention should be paid to whether the
product is affected by moisture. Because of the PCB process, more than 3 months may lead to
the