TC6203P_D2 TC6203P_D2 BLE mesh module specification 1 / 9
TC6203P_D2 Version 1.0 1.
TC6203P_D2 Contents 1 Product Overview ........................................错误!未定义书签。 1.1 Overview ...........................................错误!未定义书签。 1.2 module features ....................................错误!未定义书签。 1.3 module parameters ..................................错误!未定义书签。 1.4 main application areas .............................错误!未定义书签。 2 hardware introduction ...................................错误!未定义书签。 2.1 PIN definition ......................................................5 2.
TC6203P_D2 1 Product overview 1.1 overview TC6203P_D2 is a small and low-power bluetooth module, which can be used for SMT and pin manufacturing, and is very suitable for smart household consumer electronics products.TC6203d-SMT which is Based on advanced CMOS technology and highly integrated single BLE chip. 1.2 Module features • • • • • • Based on the bluetooth 4.
TC6203P_D2 1.4 Main application areas Smart home(bulb、socket、light switch and other device) • 2 Hardware introduction Figure 1. TC6203P_D2outside view 2.1PIN definition Table 2. TC6203P_D2 PIN definition Num Name I/O 1 P1.5 ADC1 2 P3.0 ADC2 3 P3.1 ADC3 4 P2.4 PWM5 5 P2.3 PWM4/SDA 6 P0.
TC6203P_D2 PWM（W） 7 P5.7 PWM2 8 P2.2 PWM3/SCL 9 GND GND GND 10 VDD VDD VDD 11 P2.5 I/O 12 P2.0 I/O 13 GND GND 14 P1.4 I/O 15 P1.3 RX 16 P1.2 TX 17 P1.0 I/O 18 P5.3 I/O 19 NC I/O 20 ICED - 21 ICEK - 22 P5.2 I/O 23 RST RST RST 24 GND GND GND PWM（R）&I^2C SCL I/O I/O GND I/O UART_RX UART_TX I/O I/O NC JLINK_data JLINK_ clk I/O 注：GPIO具体功能建议参考《TC6203a Datasheet_V1.0.pdf》 2.2 Electrical specification Table 3.
TC6203P_D2 Any I/O pin voltage Static levels （ HBM） TAMB=25°C 2.2 _ 3.3 V _ _ 2 KV 2.3 Module mechanical dimensions TC6203P_D2 physical size（units：mm）： Figure 2. TC6203P_D2 mechanical dimensions 3 operation instruction 3.1 Production guide It is suggested to use SMT machine to patch the package module of stamp mouth, and finish the patch within 24 hours after the packaging is unpacked. Otherwise, it should be vacuumized again to avoid the bad patch caused by dampness.
TC6203P_D2 oxidation of the welding pad, and problems such as virtual welding and missed welding may occur during the placement process. In order to ensure the qualified rate of reflow welding, it is recommended to extract 10% of the product for the first patch for visual inspection and AOI detection, so as to ensure the rationality of furnace temperature control, device adsorption mode and placement mode. Operators at all stations must wear electrostatic gloves during production. 3.
TC6203P_D2 FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 PCB antenna with antenna gain 0dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
