Specifications

TC6203D
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Figure 2. TC6203D-SMT mechanical dimensions
3 operation instruction
3.1 Production guide
It is suggested to use SMT machine to patch the package module of stamp mouth, and finish the
patch within 24 hours after the packaging is unpacked. Otherwise, it should be vacuumized again
to avoid the bad patch caused by dampness.
If the package contains a humidity indicator card, it is recommended to judge whether the module
needs to be baked according to the humidity indicator card. The baking conditions are as follows:
Stoving temperature：125℃±5℃；
Alarm temperature: 130℃；
After cooling less than 36℃ under natural conditions, SMT patch can be performed.
If the unsealing time is more than 3 months, special attention should be paid to whether the
product is affected by moisture. Because of the PCB process, more than 3 months may lead to the
oxidation of the welding pad, and problems such as virtual welding and missed welding may occur
during the placement process.
In order to ensure the qualified rate of reflow welding, it is recommended to extract 10% of the
product for the first patch for visual inspection and AOI detection, so as to ensure the rationality of
furnace temperature control, device adsorption mode and placement mode.
Operators at all stations must wear electrostatic gloves during production.