Hardware

Environmental Specifications
A DIVISION OF TRIMBLE
30 Hardware Overview
Soldered down 60 30 60 1.99
Soldered down 60 30 80 1.11
Soldered down 60 30 98 0.98
Board to board -40 30 98 No restriction
Board to board 25 23 50 No restriction
Board to board 25 23 60 2.93
Board to board 25 23 80 2.22
Board to board 25 23 98 1.24
Board to board 25 30 40 No restriction
Board to board 25 30 50 6.68
Board to board 25 30 60 2.49
Board to board 25 30 80 1.5
Board to board 25 30 98 1.06
Board to board 60 23 30 5.64
Board to board 60 23 50 1.13
Board to board 60 23 60 0.81
Board to board 60 23 80 0.54
Board to board 60 23 98 0.29
Board to board 60 30 15 No restriction
Board to board 60 30 30 1.98
Board to board 60 30 50 0.73
Board to board 60 30 60 0.56
Board to board 60 30 80 0.27
Board to board 60 30 98 0.27
Mounting
Ambient
Temp (°C)
RF Power
(dBm)
Duty Cycle
%
Time (m) to reach
max temperature