Datasheet

XTR300

SBOS336C –JUNE 2005– REVISED JUNE 2011

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

(1)

PACKAGE

PRODUCT PACKAGE-LEAD DESIGNATOR PACKAGE MARKING

XTR300 QFN-20 (5mm x 5mm) RGW XTR300

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

XTR300 UNIT

Supply Voltage, V

VSP

+44 V

Signal Input Terminals:

Voltage

(2)

(V−) − 0.5 to (V+) + 0.5 V

Current

(2)

±25 mA

DGND ±25 mA

Output Short-Circuit

(3)

Continuous

Operating Temperature –55 to +125 °C

Storage Temperature –55 to +125 °C

Junction Temperature +150 °C

Electrostatic Discharge Ratings:

Human Body Model (HBM) 2000 V

Charged Device Model (CDM) 1000 V

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails must

be current limited. DRV pin allows a peak current of 50mA. See the Output Protection section in Applications Information.

(3) See the Driver Output Disable section in Applications Information for thermal protection.