Datasheet

SG
OS
IA
CurrentCopy
OPA
R
GAIN
10kW
RG
1
RG
2
I
COPY
I
DRV
I
IA
IA
IN+
IA
IN-
DRV
IA
OUT
V
IN
C
C
47nF
C
2
100nF
C
3
100nF
R
3
1kW
R
IA
1kW
R
OS
2kW
SET
I
MON
V-
Thermal
Pad
DGND
(1)
(2)
V+
V- GND
V+
XTR300
Digital
Control
OD
M2
M1
Error
Flags
EF
CM
EF
LD
EF
OT
R
SET
2kW
GND1
GND3
GND4
R
IMON
1kW
R
C
15W
C
4
100nF
C
5
10nF
C
LOAD
ExternalLoad
LogicSupply
(+2.7Vto+5V)
Pull-upResistors
(10k )W
R
LOAD
R
6
2.2kW
R
7
2.2kW
GND1
GND1
GND2
I
MON
S
IN
IA
O
XTR300
www.ti.com SBOS336C –JUNE 2005– REVISED JUNE 2011
APPLICATION INFORMATION
(1) See the Electrical Characteristics and Digital Input and Output section for operating limits of DGND.
(2) Connect thermal pad to V−.
Figure 39. Standard Circuit Configuration
The following information should be considered during XTR300 circuit configuration:
space
• R
C
ensures stability for unknown load conditions
• Recommended bypassing: 100nF or more for
and limits the current into the internal protection
supply bypassing at each supply.
diodes. C
4
helps protect the device. Over-voltage
• R
IMON
can be in the kΩ-range or short-circuited if
clamp diodes (standard 1N4002) might be
not used. Do not leave this current output
necessary to protect the output.
unconnected—it would saturate the internal
• R
6
, R
7
, and C
5
protect the IA.
current source. The current at this I
MON
output is
• R
LOAD
and C
LOAD
represent the load resistance
I
DRV
/10. Therefore, V
IMON
= R
IMON
(I
DRV
/10).
and load capacitance.
• R
3
is not required but can match R
SET
(or
• R
SET
defines the transfer gain. It can be split to
R
SET
||R
OS
) to compensate for the bias current.
allow a signal offset and, therefore, allow a 5V
• R
IA
can be short-circuited if not used. Do not leave
single-supply digital-to-analog converter (DAC) to
this current output unconnected. R
GAIN
is selected
control a ±10V or ±20mA output signal.
to 10kΩ to match the output of 10V with 20mA for
the equal input signal. space
space
space
Copyright © 2005–2011, Texas Instruments Incorporated 17