Datasheet

M2
M1
V
IN
SET
I
MON
Pad
V+
NC
DRV
NC
V-
1
2
3
4
5
15
14
13
12
11
IA
OUT
IA
IN-
IA
IN+
RG
1
RG
2
OD
EF
OT
EF
LD
EF
CM
DGND
Exposed
Thermal
DiePad
on
Underside
(mustbe
connected
toV )-
6 7 8 9 10
20 19 18 17 16
XTR300
SBOS336C –JUNE 2005– REVISED JUNE 2011 www.ti.com
PIN CONFIGURATIONS
RGW PACKAGE
QFN-20
(TOP VIEW)
PIN ASSIGNMENTS
PIN NO. NAME FUNCTION
1 M2 Mode Input
2 M1 Mode Input
3 V
IN
Noninverting Signal Input
4 SET Input for Gain Setting; Inverting Input
5 I
MON
Current Monitor Output
6 IA
OUT
Instrumentation Amplifier Signal Output
7 IA
IN–
Instrumentation Amplifier Inverting Input
8 IA
IN+
Instrumentation Amplifier Noninverting Input
9 RG1 Instrumentation Amplifier Gain Resistor
10 RG2 Instrumentation Amplifier Gain Resistor
11 V– Negative Power Supply
12 NC No Internal Connection
13 DRV Operational Amplifier Output
14 NC No Internal Connection
15 V+ Positive Power Supply
16 DGND Ground for Digital I/O
17 EF
CM
Error Flag for Common-Mode Over-Range, Active Low
18 EF
LD
Error Flag for Load Error, Active Low
19 EF
OT
Error Flag for Over Temperature, Active Low
20 OD Output Disable, Disabled Low
Pad Exposed Pad Exposed thermal pad must be connected to V−
10 Copyright © 2005–2011, Texas Instruments Incorporated