Datasheet

1
2
3
4
5
10
9
8
7
6
GND
OD
EF
SET
VIN
VSP
IS
VG
REGS
REGF
Pad
Exposed
Thermal
DiePad
on
Underside.
(Mustbe
connected
toGND)
VSP
IS
VG
REGS
REGF
GND
OD
EF
SET
VIN
1
2
3
4
5
10
9
8
7
6
Pad
Exposed
Thermal
DiePad
on
Underside.
(Mustbe
connected
toGND)
XTR111
www.ti.com SBOS375C –NOVEMBER 2006– REVISED JUNE 2011
PIN CONFIGURATIONS
DGQ PACKAGE DRC PACKAGE
MSOP-10 DFN-10
TOP VIEW TOP VIEW
PIN DESCRIPTIONS
PIN NAME FUNCTION
1 VSP Positive Supply
2 IS Source Connection
3 VG Gate Drive
4 REGS Regulator Sense
5 REGF Regulator Force
6 VIN Input Voltage
7 SET Transconductance Set
8 EF Error Flag (Active Low)
9 OD Output Disable (Active High)
10 GND Negative Supply
Pad Pad Exposed Thermal Pad must be connected to GND
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