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XRT111

REGF

Regulator

Out

Signal

Input

REGS

24V

I-Mirror

VSP

OutputDisable

OutputFailure

SET

710

GND

I =10

OUT

()

VIN

SET

I 10

OUT

SET

= · I

XTR111

(1)

15W

10nF

0mAto20mA

4mAto20mA

Load

(±LoadGround)

XTR111

www.ti.com

SBOS375C –NOVEMBER 2006– REVISED JUNE 2011

Precision Voltage-to-Current

Converter/Transmitter

Check for Samples: XTR111

FEATURES

DESCRIPTION

The XTR111 is a precision voltage-to-current

• EASY-TO-DESIGN INPUT/OUTPUT RANGES:

converter designed for the standard 0mA–20mA or

0mA–20mA, 4mA–20mA, 5mA–25mA AND

4mA–20mA analog signals, and can source up to

VOLTAGE OUTPUTS

36mA. The ratio between input voltage and output

• NONLINEARITY: 0.002%

current is set by the single resistor R

SET

. The circuit

• LOW OFFSET DRIFT: 1μV/°C

can also be modified for voltage output.

• ACCURACY: 0.015%

An external P-MOSFET transistor ensures high

• SINGLE-SUPPLY OPERATION

output resistance and a broad compliance voltage

• WIDE SUPPLY RANGE: 7V to 44V

range that extends from 2V below the supply voltage,

• OUTPUT ERROR FLAG (EF)

VSP

, to voltages well below GND.

• OUTPUT DISABLE (OD)

The adjustable 3V to 15V sub-regulator output

• ADJUSTABLE VOLTAGE REGULATOR:

provides the supply voltage for additional circuitry.

3V to 15V

The XTR111 is available in MSOP and DFN

surface-mount packages.

APPLICATIONS

• UNIVERSAL VOLTAGE-CONTROLLED

CURRENT SOURCE

• CURRENT OR VOLTAGE OUTPUT FOR 3-WIRE

SENSOR SYSTEMS

• PLC OUTPUT PROGRAMMABLE DRIVER

• CURRENT-MODE SENSOR EXCITATION

NOTE: (1) See Application Information,

External Current Limit Circuits for other

options.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (32 pages)

PAGE 1
XR T111 XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com Precision Voltage-to-Current Converter/Transmitter Check for Samples: XTR111 FEATURES DESCRIPTION • The XTR111 is a precision voltage-to-current converter designed for the standard 0mA–20mA or 4mA–20mA analog signals, and can source up to 36mA. The ratio between input voltage and output current is set by the single resistor RSET. The circuit can also be modified for voltage output.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VVSP = +24V, RSET = 2.0kΩ, REGF connected to REGS; OD = Low, External FET connected, unless otherwise noted. XTR111 PARAMETER CONDITIONS MIN Specified Performance (1) 0.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VVSP = +24V, RSET = 2.0kΩ, REGF connected to REGS; OD = Low, External FET connected, unless otherwise noted. XTR111 PARAMETER CONDITIONS MIN TYP MAX RLOAD = 5kΩ 2.85 3.0 3.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com PIN CONFIGURATIONS DGQ PACKAGE MSOP-10 TOP VIEW VSP 1 IS 2 VG 3 REGS 4 REGF 5 Exposed Thermal Die Pad on Underside. (Must be connected to GND) DRC PACKAGE DFN-10 TOP VIEW 10 GND 9 OD 8 EF 7 SET 6 VIN VSP 1 IS 2 VG 3 REGS 4 REGF 5 Exposed Thermal Die Pad on Underside.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and VVSP = +24V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE 700 530 650 510 Quiescent Current (mA) Quiescent Current (mA) QUIESCENT CURRENT vs SUPPLY VOLTAGE 550 490 470 450 430 410 390 600 550 500 450 400 350 370 350 300 5 10 15 20 25 30 35 40 45 -75 -50 -25 Supply Voltage (V) Figure 1.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VVSP = +24V, unless otherwise noted. GAIN ERROR DISTRIBUTION -0.01 -0.009 -0.008 -0.007 -0.006 -0.005 -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 0.009 0.01 -0.1 -0.09 -0.08 -0.07 -0.06 -0.05 -0.04 -0.03 -0.02 -0.01 0 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VVSP = +24V, unless otherwise noted. TYPICAL NONLINEARITY (2pt Calibration at 0.1mA and 25mA) 0.0020 0.0020 0.0015 0.0015 0.0010 0.0010 Nonlinearity (%) Nonlinearity (%) TYPICAL NONLINEARITY (2pt Calibration at 4mA and 20mA) 0.0005 0.000 -0.0005 0.0005 0.000 -0.0005 -0.0010 -0.0010 -0.0015 -0.0015 -0.0020 -0.0020 4 8 12 16 0 20 5 10 IOUT (mA) 0.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VVSP = +24V, unless otherwise noted. INPUT OFFSET VOLTAGE DRIFT DISTRIBUTION Population Population INPUT OFFSET VOLTAGE DISTRIBUTION -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 -5 -4 -3 -2 VOS (mV) -1 Figure 19. 1 2 3 4 5 Figure 20.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VVSP = +24V, unless otherwise noted. REGULATOR VOLTAGE DISTRIBUTION REGULATOR VOLTAGE DRIFT DISTRIBUTION ILOAD = 0.6mA 2.850 2.865 2.880 2.895 2.910 2.925 2.940 2.955 2.970 2.985 3 3.015 3.030 3.045 3.060 3.075 3.090 3.105 3.120 3.135 3.150 Population Population ILOAD = 0.6mA 0 10 20 30 40 50 60 70 80 More Regulator Voltage Drift (ppm/°C) Regulator Voltage (V) Figure 26.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VVSP = +24V, unless otherwise noted. STEP RESPONSE: VFS = 4V, RSET = 2kΩ, RLD = 600Ω (Rising Edge Depends on CGATE at VG Pin) STEP RESPONSE: VFS = 2.5V, RSET = 1.25kΩ, RLD = 600Ω (Rising Edge Depends on CGATE at VG Pin) Photo taken with CGATE = 130pF Photo taken with CGATE = 130pF 5V/div 10V/div 5V/div 2V/div 10ms/div 10ms/div Figure 31. Figure 32.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com APPLICATION INFORMATION used during power-on, multiplexing and other conditions where the output should present no current. It has an internal pull-up that causes the XTR111 to come up in output disable mode unless the OD pin is tied low. The XTR111 is a voltage-controlled current source capable of delivering currents from 0mA to 36mA.
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XTR111 www.ti.com EXPLANATION OF PIN FUNCTIONS VIN: This input is a conventional, noninverting, high-impedance input of the internal operational amplifier (OPA). The internal circuitry is protected by clamp diodes to supplies. An additional clamp connected to approximately 18V protects internal circuitry. Place a small resistor in series with the input to limit the current into the protection if voltage can be present without the XTR111 being powered.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com IS IS R6 15W R6 15W Q2 Q1 VG Q2 R7 15W R8 5kW IOUT C3 10nF Q3 Table 1 lists some example devices in SO-compatible packages, but other devices can be used as well. Avoid external capacitance from IS. This capacitance could be compensated by adding additional capacitance from VG to IS; however, this compensation may slow the output down.
PAGE 15
XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com DYNAMIC PERFORMANCE The rise time of the output current is dominated by the gate capacitance of the external FET. The accuracy of the current mirror relies on the dynamic matching of multiple individual current sources. Settling to full resolution may require a complete cycle lasting around 100μs.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com External FET NOTE: Scale has been changed from Figure 38 and Figure 39. 5mV/div Typical Filter RF 10kW 500W CF 10nF 20ms/div Figure 41. Output with Additional Filter OUTPUT ERROR FLAG AND DISABLE INPUT INPUT VOLTAGE The XTR111 has additional internal circuitry to detect an error in the output current.
PAGE 17
XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com More protection against negative input signals is provided using a standard diode and a 2.2kΩ resistor, as shown in Figure 42. 2.2kW V-Signal VIN 1N4148 Figure 42. Enhanced Protection Against Negative Overload of VIN 4mA–20mA OUTPUT The XTR111 does not provide internal circuits to generate 4mA with 0V input signal.
PAGE 18
XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com VOLTAGE REGULATOR The externally adjustable voltage regulator provides up to 5mA of current. It offers drive (REGF) and sense (REGS) to allow external setting of the output voltage as shown in Figure 45. The sense input (REGS) is referenced to 3.0V representing the lowest adjustable voltage level. An external resistor divider sets VREGF. VREGF = VREGS · (R1 + R2)/R2 Table 2 provides example values for the regulator adjustment resistors.
PAGE 19
XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com APPLICATION BLOCK DIAGRAMS 1 VSP 5 5V C2 470nF R1 2kW 4 Current Mirror REGF OD 9 EF 8 IS 2 REGS 15W (1) R2 3kW S Q2 VG Q1 G 3 D 3V 15W Digital I/O 12-Bit Digital-to-Analog Converter DAC7551 R3 2.5kW 6 10nF VIN GND SET 10 7 0mA to 20mA CLOAD RSET 2.5kW RLOAD Figure 46.
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XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com 1 VSP 5 4 OD 9 EF 8 IS 2 Current Mirror REGF REGS 15W (1) S Q2 VG Q1 G 3 D 3V 15W 0V to 10V Signal Input 6 10nF VIN GND SET 10 7 Load SW1 RSET 5kW CLOAD RLOAD Current (open) or Voltage (close) Output When output disabled and SW1 is closed, pin 7 may generate an error signal. Figure 48.
PAGE 21
XTR111 SBOS375C – NOVEMBER 2006 – REVISED JUNE 2011 www.ti.com PACKAGE AND HEAT SINKING The dominant portion of power dissipation for the current output is in the external FET. The XTR111 only generates heat from the supply voltage with the quiescent current, the internal signal current that is 1/10 of the output current, and the current and internal voltage drop of the regulator.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 24-May-2011 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant XTR111AIDGQR MSOPPower PAD DGQ 10 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 XTR111AIDGQT MSOPPower PAD DGQ 10 250 180.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 XTR111AIDRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) XTR111AIDGQR MSOP-PowerPAD DGQ 10 2500 370.0 355.0 55.0 XTR111AIDGQT MSOP-PowerPAD DGQ 10 250 195.0 200.0 45.0 XTR111AIDRCR SON DRC 10 3000 367.0 367.0 35.0 XTR111AIDRCT SON DRC 10 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.