Datasheet

Table Of Contents

Through-holelead

makescontactto

pinsocketwith

springaction.

PINDIA

0.36-0.56

[.014-.022]

SPRING

EYELET

6.60

[.260]

2.54

[.100]

CONTACTPT

MIN

6.27

[.247]MAXPINLENGTH

Hardware Setup

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2.3.3 Test Points and Miscellaneous Breadboard Area

There are multiple points available on the Sensor Board, including several connections to I

RET

. I

RET

common (labeled as GND on the board) for most XTR108 applications, and is provided for ease of

measuring analog signals. Reserved areas with plated-through, standard-spacing, 0.1-inch holes for

miscellaneous proof-of-concept breadboarding are also provided on the board. Most of the surface-mount

components have pin sockets associated with them. These pin sockets allow the replacement of a

surface-mount component with a through-hole component.

The pin sockets provide good contact with the leads of a component without solder, thus enabling quick

reconfiguration of the board for many different XTR108 designs, as shown in Figure 6.

Figure 6. Pin Socket Mechanical Description

3 Hardware Setup

The XTR108EVM-USB hardware setup involves connecting the three EVM boards together, applying

power to the USB DAQ platform, connecting the USB cable, applying power to the Interface Board, and

setting the jumpers. This section covers the details of this procedure.

3.1 Electrostatic Discharge Warning

CAUTION

Many of the components on the XTR108EVM-USB are susceptible to damage

by electrostatic discharge (ESD). Customers are advised to observe proper

ESD handling precautions when unpacking and handling the EVM, including

the use of a grounded wrist strap at an approved ESD workstation.

XTR108EVM-USB Evaluation Board and Software Tutorial SBOU123–March 2012

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