Datasheet

XIO2213B
SCPS210F –OCTOBER 2008–REVISED MAY 2013 www.ti.com
11 Electrical Characteristics
11.1 Absolute Maximum Ratings
(1)
over operating temperature range (unless otherwise noted)
VALUE UNIT
V
SUP_33
Supply voltage DVDD_33, V
DDA_33
, V
DDA_33
, V
DDPLL_33
, V
DD_33_COMB
,
0.3 to 3.6 V
range V
DD_33_COMBIO
V
SUP_15
Supply voltage
V
DD_15
, V
DDA_15
, V
PP
, V
DDPL L
, V
DD_15_COMB
0.5 to 1.65 V
range
V
CORE_195
Supply voltage
PLLVDD_CORE, DVDD_CORE 0.5 to 2.05 V
range
PCIe (RX) 0.5 to V
SUP_33
+ 0.5
PCIe REFCLK (single ended) 0.5 to V
SUP_15
+ 0.5
V
I
Input voltage range PCIe REFCLK (differential) 0.5 to V
SUP_33
+ 0.5 V
Miscellaneous 3.3-V I/O 0.5 to V
SUP_33
+ 0.5
PHY interface 0.5 to V
SUP_33
+ 0.5
PCIe (TX) 0.5 to V
SUP_15
+ 0.5
Output voltage
V
O
Miscellaneous 3.3-V I/O 0.5 to V
SUP_33
+ 0.5 V
range
PHY interface 0.5 to V
SUP_33
+ 0.5
Input clamp current (V
I
< 0 or V
I
> VDD)
(2)
20 mA
Output clamp current (V
O
< 0 or V
O
> VDD)
(3)
20 mA
T
stg
Storage temperature range -65 to 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Applies for external input and bidirectional buffers. V
I
< 0 or V
I
> V
DD
or V
I
> V
CCP
(3) Applies for external input and bidirectional buffers. V
O
< 0 or V
O
> V
DD
or V
O
> V
CCP
11.2 Recommended Operating Conditions
OPERATION MIN NOM MAX UNIT
V
SUP_15
Supply voltage 1.5 V 1.35 1.5 1.65 V
V
SUP_33
Supply voltage (I/O) 3.3 V 3 3.3 3.6 V
V
CORE_195
Supply voltage 1.95 V 1.85 1.95 2.05 V
0 25 70 °C
T
A
Operating ambient temperature
Industrial -40 85
T
J
Junction temperature 0 25 105 °C
Low K JEDEC test board, 85 °C/W
1s, no air flow - ZAY
Low K JEDEC test board, 88 °C/W
1s, no air flow - ZAJ
High K JEDEC test board, 65 °C/W
2s2p no air flow - ZAY
θ
JA
Junction-to-free-air thermal resistance
High K JEDEC test board, 42.1 °C/W
2s2p no air flow - ZAJ
High K JEDEC test board, 52 °C/W
2s2p 200 LFM - ZAY
High K JEDEC test board, 33 °C/W
2s2p 200 LFM - ZAJ
Cu cold plate measurement process - 13 °C/W
ZAY
θ
JC
Junction-to-case thermal resistance
Cu cold plate measurement process - 13 °C/W
ZAJ
190 Electrical Characteristics Copyright © 2008–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: XIO2213B