Datasheet

XIO2001
www.ti.com SCPS212G –MAY 2009–REVISED DECEMBER 2012
ZAJ Thermal Characteristics
(1)
(continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
T
J
XIO2001ZGU 0 105
Virtual junction temperature °C
XIO2001IZGU –40 105
7.12 ZGU Thermal Characteristics
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θ
JA
Low-K JEDEC test board, 1s (single signal layer), no air
85
flow
Junction-to-free-air thermal
°C/W
resistance
High-K JEDEC test board, 2s2p (double signal layer,
48.3
double buried power plane), no air flow
θ
JC
Junction-to-case thermal resistance Cu cold plate measurement process 8.5 °C/W
θ
JB
Junction-to-board thermal
EIA/JESD 51-8 25.4 °C/W
resistance
ψ
JT
Junction-to-top of package EIA/JESD 51-2 0.5 °C/W
ψ
JB
Junction-to-board EIA/JESD 51-6 24 °C/W
T
A
XIO2001ZGU 0 70
Operating ambient temperature
°C
range
XIO2001IZGU –40 85
T
J
XIO2001ZGU 0 105
Virtual junction temperature °C
XIO2001IZGU –40 105
(1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953).
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