Datasheet

XIO2001
SCPS212G –MAY 2009–REVISED DECEMBER 2012 www.ti.com
7.9 PCI Bus Timing Requirements
(1)
over recommended operating conditions
33 MHz 66 MHz
PARAMETER TEST CONDITION UNIT
MIN MAX MIN MAX
C
L
= 50 pF 11
CLK to shared signal valid propagation delay time
C
L
= 30 pF 6
t
pd
ns
C
L
= 50 pF 2
CLK to shared signal invalid propagation delay time
C
L
= 30 pF 1
C
L
= 50 pF 2
tEnable time, high-impedance-to-active delay time
t
ON
ns
from CLK
C
L
= 30 pF 1
C
L
= 50 pF 28
Disable time, active-to-high-impedance delay time
t
OFF
ns
from CLK
C
L
= 30 pF 14
Setup time on shared signals before CLK valid
t
su
7 3 ns
(rising edge)
Hold time on shared signals after CLK valid (rising
t
h
0 0 ns
edge)
(1) The PCI shared signals are AD31:0, C/BE[3:0], FRAME, TRDY, IRDY, STOP, IDSEL, DEVSEL, LOCK, SERIRQ, PAR, PERR, SERR,
and CLKRUN.
7.10 PNP Thermal Characteristics
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θ
JA
Low-K JEDEC test board, 1s (single signal layer), no air
50.8
flow
Junction-to-free-air thermal
°C/W
resistance
High-K JEDEC test board, 2s2p (double signal layer,
24.9
double buried power plane), no air flow
θ
JC
Junction-to-case thermal resistance Cu cold plate measurement process 18.9 °C/W
θ
JB
Junction-to-board thermal
EIA/JESD 51-8 14.6 °C/W
resistance
ψ
JT
Junction-to-top of package EIA/JESD 51-2 0.26 °C/W
ψ
JB
Junction-to-board EIA/JESD 51-6 7.93 °C/W
T
A
XIO2001PNP 0 70
Operating ambient temperature
°C
range
XIO2001IPNP –40 85
T
J
XIO2001PNP 0 105
Virtual junction temperature °C
XIO2001IPNP –40 105
(1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953).
7.11 ZAJ Thermal Characteristics
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θ
JA
Low-K JEDEC test board, 1s (single signal layer), no air
82
flow
Junction-to-free-air thermal
°C/W
resistance
High-K JEDEC test board, 2s2p (double signal layer,
58.8
double buried power plane), no air flow
θ
JC
Junction-to-case thermal resistance Cu cold plate measurement process 19 °C/W
θ
JB
Junction-to-board thermal
EIA/JESD 51-8 32 °C/W
resistance
ψ
JT
Junction-to-top of package EIA/JESD 51-2 0.5 °C/W
ψ
JB
Junction-to-board EIA/JESD 51-6 30 °C/W
T
A
XIO2001ZGU 0 70
Operating ambient temperature
°C
range
XIO2001IZGU –40 85
(1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953).
120 Electrical Characteristics Copyright © 2009–2012, Texas Instruments Incorporated
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