Datasheet

Filename: HPA083A_bom.xls
Date: 06/22/2004
HPA083A BOM
COUNT
RefDes
DESCRIPTION
SIZE
MFR
PART NUMBER
2
C1, C5
Capacitor, Ceramic, 10-uF, 6.3-V, X5R, 10% 805 muRata GRM21BR60J106KE01
2
C11, C12
Capacitor, Ceramic, 0.047-uF, 25-V, X7R, 10% 603 muRata GRM188R71E473KA01
2
C13, C14
Capacitor, Ceramic, 3300-pF, 50-V, X7R, 10% 603 muRata GRM188R71H332KA01
2
C15, C17
Capacitor, Ceramic, 27-pF, 50-V, C0G, 5% 603 muRata GRM1885C1H270JA01D
2
C16, C18
Capacitor, Ceramic, 2700-pF, 50-V, X7R, 10% 603 muRata GRM188R71H272KA01D
2
C19, C20
Capacitor, Ceramic, 22-uF, 10-V, X5R, 10% 1210 muRata GRM32ER61A226KA65
2
C2, C4
Capacitor, Ceramic, 1.0-uF, 6.3-V, X5R, 10% 603 muRata GRM188R60J105KA01
2
C23, C24
Capacitor, Ceramic, 470-pF, 50-V, X7R, 10% 603 muRata GRM188R71H471KA01
4
C3, C8, C21, C22
Capacitor,Tantalum, 330-uF, 6.3-V, 600-milliohm, 20% 7343(D) Vishay 293D337X96R3D2
1
C6
Capacitor, Ceramic, 0.056-uF, 16-V, X7R, 10% 603 muRata GRM188R71C563KC01
1
C7
Capacitor, Ceramic, 0.33-uF, 10-V, X5R, 10% 603 muRata GRM188R61A334KA61
2
C9, C10
Capacitor, Ceramic, 2.2-uF, 6.3-V, X5R, 10% 805 muRata GRM21BR60J225KC01
8
J1 - J8
Header, 2-pin, 100mil spacing, (36-pin strip) 0.100 x 2 Sullins PTC36SAAN
2
L1, L2
Inductor, SMT, 6.8-uH, 2.2-A, 75-milliohm 0.51x0.37 Coilcraft DS3316P-682
3
R1, R2, R9
Resistor, Chip, 71.5k-Ohms, 1/16-W, 1% 603 Std Std
2
R10, R11
Resistor, Chip, 30.1k-Ohms, 1/16-W, 1% 603 Std Std
2
R12, R13
Resistor, Chip, 1.91k-Ohms, 1/16-W, 1% 603 Std Std
3
R3, R14, R15
Resistor, Chip, 10k-Ohms, 1/16-W, 1% 603 Std Std
1
R4
Resistor, Chip, 511k-Ohms, 1/16-W, 1% 603 Std Std
2
R5, R6
Resistor, Chip, 2.4-Ohms, 1/8-W, 1% 1206 Std Std
1
R7
Resistor, Chip, 28.7k-Ohms, 1/16-W, 1% 603 Std Std
1
R8
Resistor, Chip, 3.74k-Ohms, 1/16-W, 1% 603 Std Std
1
S1
Switch, 1P2T, Slide, PC-mount, 200-mA 79900 E_Switch EG1218
1
U1
IC, Utralow-Noise, High PSRR, Fast RF 250 mA, LDO
Linear Regulators, 2.5-V
MSOP-8 TI TPS79425DGN
2
U2, U3
IC, SWIFT Power Controller, Adj-V, 1.5A PWP20 TI TPS54110PWP
1
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PCB, 3.1 In x 2.4 In x .062 In Any HPA083
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants.
Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.