Datasheet
Filename: HPA079A_bom.xls
Date: 08/17/2004
HPA079A BOM
COUNT
RefDes Description SIZE MFR Part Number
1
C1
Capacitor, Ceramic, 22-uF, 10-V, X5R, 10% 1210 muRata GRM32ER61A226KA65
0
C10, C11
Capacitor, Ceramic, xx-uF, xx-V 603
4
C2, C3, C4, C5
Capacitor, Ceramic, 2.2-uF, 6.3-V, X5R, 10% 805 muRata GRM21BR60J225KC01
3
C6, C12, C13
Capacitor, Tantalum, 100-uF, 10-V, 95-milliohm, 20% 7343 (D) Vishay 594D107X0010D2T
1
C7
Capacitor, Ceramic, 0.1-uF, 25-V, X7R, 10% 603 muRata GRM188R71E104KA01
1
C8
Capacitor, Ceramic, 0.033-uF, 16-V, X7R, 10% 603 muRata GRM188R71C333KA01
1
C9
Capacitor, Ceramic, 1.0-uF, 6.3-V, X5R, 10% 603 muRata GRM188R60J105KA01
1
D1
Diode, Schottky Barrier Rectifier, 3-A, 20-V SMA Diodes Inc. B320A
8
J1 - J8
Header, 2-pin, 100mil spacing, (36-pin strip) 0.100 x 2 Sullins PTC36SAAN
1
L1
Inductor, SMT, 4.7-uH, 4.5-A, 2-milliohm 0.484 x 0.484 Coilcraft MSS1260-472MX
2
Q1, Q2
Bipolar, NPN, 30-V, 800-mA, 310-mW SOT23 Vishay BC818-16
1
Q3
MOSFET, P-ch, 20V,4.8-A, 76-milliohm 1206-8 Vishay Si5475DC
1
Q4
MOSFET, P-ch, -20 V, 4 A, 51 milliohm SOT23 Vishay Si2323DS
0
Q5
MOSFET, N-ch SOT23
0
Q6
MOSFET, P-ch SOT23
4
R1, R2, R5, R13
Resistor, Chip, 100k-Ohms, 1/16-W, 1% 603 Std Std
1
R3
Resistor, Chip, 221k-Ohms, 1/16-W, 1% 603 Std Std
1
R4
Resistor, Chip, 0.02-Ohms, 1/4-W, 1% 1210 Std Std
1
R6
Resistor, Chip, 210k-Ohms, 1/16-W, 1% 603 Std Std
1
R7
Resistor, Chip, 100-Ohms, 1/16-W, 1% 603 Std Std
3
R8, R11, R14
Resistor, Chip, 0-Ohms, 1/16-W, 5% 603 Std Std
0
R9, R10, R12, R15,
R16
Resistor, Chip, xx-Ohms, 1/16-W 603
1
S1
Switch, 1P2T, Slide, PC-mount, 200-mA 0.46 x 0.16 E_Switch EG1218
1
U1
IC, Voltage Supervisor, Micropower TSSOP-8 TI TLC7705PW
1
U2
IC, Step-Down Controller SOT23-6 TI TPS64203DBV
1
U3
IC, Utralow-Noise, High PSRR, Fast RF 250 mA, LDO
Linear Regulators, 2.5V
MSOP 8 TI TPS79425DGN
1
U4
IC, Ultra Low-Noise, High PSRR, Fast RF 1.5A LDO
Linear Regulator
DDPAK-5 TI TPS78633KTT
1
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PCB, 2.7 In x 2.45 In x 0.062 In Any HPA079
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants.
Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.