Data Sheet

www.ti.com
MOC0100A
EXAMPLE
STENCIL
DESIGN
QFM - 2.0
mm max height
QUAD FLAT
MODULE
2X (11.95)
64
1
49
G1 G7
G13
G19 G25
G31
60X
(0.4)
2X
(12.05)
60X
(0.75)
SYMM
(1.05)
TYP
56X
(0.7)
(1.4) TYP
SEE
DETAIL B
G6 G12
G18
G24 G30
G36
(1.05) TYP (1.4)
TYP
17
33
SEE
DETAIL
A
SYMM
SOLDER PASTE
EXAMPLE
BASED ON 0.125 mm
THICK STENCIL
SOLDER
PASTE
PADS 1, 17, 33, 49,
G1-G36
90% PRINTED
COVERAGE
BY
AREA
SCALE:
8X
SOLDER
PASTE
METAL UNDER
SOLDER
MASK
METAL UNDER
SOLDER MASK
4X (0.713)
SOLDER
MASK
SOLDER
MASK
DETAIL A
EDGE EDGE
36X (0.95)
SCALE 20X
DETAIL B
SCALE
20X
4221006 / B 10/2016
NOTES:
(continued)
7.
Laser cutting apertures with trapezoidal
walls and
rounded corners
may
offer better paste release. IPC-7525
may have
alternate
design recommendations..