Data Sheet

www.ti.com
G6
MOC0100A
EXAMPLE BOARD LAYOUT
QFM - 2.0
mm max height
QUAD FLAT
MODULE
2X (11.95)
64
1
49
G1
G7
G13
G19
G25
G31
2X
(12.05)
(1.05)
TYP
56X
(0.7)
SYMM
(1.4)
TYP
60X (0.75)
G12
G18
G24 G30
G36
(1.05) TYP (1.4)
TYP
60X
(0.4)
4X (0.75)
17
33
36X
(1)
SYMM
LAND
PATTERN
EXAMPLE
SCALE:
8X
SOLDER MASK
DETAILS
SOLDER
MASK
DEFINED
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
(R0.05)
TYP
SOLDER MASK
4221006 / B 10/2016
NOTES:
(continued)
4.
This
package is designed
to
be
soldered to thermal
pads on
the board. For
more
information,
see
Texas Instruments
literature
number
SLUA271 (www.ti.com/lit/slua271)
.
5.
Solder
mask
tolerances between
and around signal pads can
vary
based on
board fabrication
site.
6. Vias
are optional
depending on
application, refer to
device
data sheet. If
any vias
are implemented, it
is recommended
that
vias
under paste
be
filled,
plugged
or
tented.