Data Sheet

4X
60X
A
MOC0100A
PACKAGE
OUTLINE
QFM - 2.0
mm max height
QUAD FLAT
MODULE
13.4
B
13.2
1
PIN 1
INDEX AREA
13.5
13.3
C
2 MAX
0.08
C
2X 11.95
2X 9.8
7.7
TYP
17
33
G6
G36
56X
0.7
2X 9.8
7.7
TYP
G3
(1.4)
TYP
NOTES:
2X
12.05
PIN 2
ID
0.8
0.7
1
36X
G1
64
1.05
0.95
G7
G19
SYMM
G31
49
(1.4)
TYP
0.7
0.45
0.35
0.1 C A
B
0.05
C
4221006/B
10/2016
1.
All linear
dimensions
are
in
millimeters.
Any dimensions in
parenthesis are for reference
only. Dimensioning and tolerancing
per ASME
Y14.5M.
2.
This drawing
is
subject to
change
without
notice.
3. The package
thermal
pads
must
be
soldered to the printed circuit board for thermal
and mechanical performance.