Data Sheet

WL1801MOD,
WL1805MO
D
,
WL1831MO
D
,
WL1835MOD
SWRS152M – JULY 2013 – REVISED OCTOBER 2017
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Applications, Implementation, and Layout 37
Copyright © 2013–2017, Texas Instruments Incorporated
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WL1835MOD
7.1.6 Baking and SMT Recommendations
7.1.6.1 Baking Recommendations
Follow these baking guidelines for the WiLink 8 module:
• Follow MSL level 3 to perform the baking process.
• After the bag is open, devices subjected to reflow solder or other high temperature processes must be
mounted within 168 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.
• If the Humidity Indicator Card reads >10%, devices require baking before they are mounted.
• If baking is required, bake devices for 8 hours at 125°C.
7.1.6.2 SMT Recommendations
Figure 7-6 shows the recommended reflow profile for the WiLink 8 module.
Temp
(degC)
D3
D2
T3
D1
T1 T2
Meating
Preheat
Soldering
Cooling
Figure 7-6. Reflow Profile for the WiLink 8 Module
Table 7-3 lists the temperature values for the profile shown in Figure 7-6.
Table 7-3. Temperature Values for Reflow Profile
Time
(SeC)
ITEM
TEMPERATURE (°C) TIME (s)
Preheat D1 to approximately D2: 140 to 200 T1: 80 to approximately 120
Soldering D2: 220 T2: 60 ±10
Peak temperature D3: 250 maximum T3: 10
NOTE
TI does not recommend the use of conformal coating or similar material on the WiLink 8
module. This coating can lead to localized stress on the WCSP solder connections inside the
module and impact the device reliability. Care should be taken during module assembly
process to the final PCB to avoid the presence of foreign material inside the module.