Data Sheet

WL1801MOD,
WL1805MO
D
,
WL1831MO
D
,
WL1835MOD
SWRS152M – JULY 2013 – REVISED OCTOBER 2017
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Applications, Implementation, and Layout 35
Copyright © 2013–2017, Texas Instruments Incorporated
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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD
WL1835MOD
7.1.4 Module Layout Recommendations
Figure 7-3 shows layer 1 and layer 2 of the TI module layout.
Layer
1
Figure 7-3. TI Module Layout
Layer 2 (Solid GND)
Follow these module layout recommendations:
• Ensure a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.
• Signal traces can be run on a third layer under the solid ground layer and beneath the module
mounting.
• Run the host interfaces with ground on the adjacent layer to improve the return path.
• TI recommends routing the signals as short as possible to the host.
7.1.5 Thermal Board Recommendations
The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way
to the module ground pads.
TI recommends using one big ground pad under the module with vias all the way to connect the pad to
all ground layers (see Figure 7-4).