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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152M – JULY 2013 – REVISED April 2019

WL18xxMOD WiLink™ 8 Single-Band Combo Module –

Wi-Fi

, Bluetooth

, and Bluetooth

Low Energy (LE)

1 Device Overview

1.1 Features

• General

– Integrates RF, Power Amplifiers (PAs), Clock,

RF Switches, Filters, Passives, and Power

Management

– Quick Hardware Design With TI Module

Collateral and Reference Designs

– Operating Temperature: –20°C to +70°C

– Small Form Factor: 13.3 × 13.4 × 2 mm

– 100-Pin MOC Package

– FCC, IC, ETSI/CE, and TELEC Certified With

PCB, Dipole, Chip, and PIFA Antennas

• Wi-Fi

– WLAN Baseband Processor and RF Transceiver

Support of IEEE Std 802.11b, 802.11g, and

802.11n

– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO

at 2.4 GHz for High Throughput: 80 Mbps

(TCP), 100 Mbps (UDP)

– 2.4-GHz MRC Support for Extended Range

– Fully Calibrated: Production Calibration Not

Required

– 4-Bit SDIO Host Interface Support

– Wi-Fi Direct Concurrent Operation

(Multichannel, Multirole)

1.2 Applications

• Internet of Things (IoT)

• Multimedia

• Home Electronics

• Home Appliances and White Goods

• Bluetooth

and Bluetooth low energy

(WL183xMOD Only)

– Bluetooth 4.2 Secure Connection Compliant and

CSA2 Support (Declaration ID: D032799)

– Host Controller Interface (HCI) Transport for

Bluetooth Over UART

– Dedicated Audio Processor Support of SBC

Encoding + A2DP

– Dual-Mode Bluetooth and Bluetooth Low Energy

– TI's Bluetooth- and Bluetooth Low Energy-

Certified Stack

• Key Benefits

– Reduces Design Overhead

– Differentiated Use Cases by Configuring

WiLink™ 8 Simultaneously in Two Roles (STA

and AP) to Connect Directly With Other Wi-Fi

Devices on Different RF Channel (Wi-Fi

Networks)

– Best-in-Class Wi-Fi With High-Performance

Audio and Video Streaming Reference

Applications With Up to 1.4× the Range Versus

One Antenna

– Different Provisioning Methods for In-Home

Devices Connectivity to Wi-Fi in One

Step

– Lowest Wi-Fi Power Consumption in Connected

Idle (< 800 µA)

– Configurable Wake on WLAN Filters to Only

Wake Up the System

– Wi-Fi-Bluetooth Single Antenna Coexistence

• Industrial and Home Automation

• Smart Gateway and Metering

• Video Conferencing

• Video Camera and Security

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Summary of content (54 pages)

PAGE 1
Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED April 2019 WL18xxMOD WiLink™ 8 Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth® Low Energy (LE) 1 Device Overview 1.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 1.3 www.ti.com Description The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi ® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux®and Android™.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table of Contents Device Overview ......................................... 1 1 Features .............................................. 1 Description ............................................ 2 5.17 Revision History ......................................... 3 Device Comparison ..................................... 4 5.19 Timing and Switching Characteristics ............... 17 Related Products .....
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 3 Device Comparison The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 3-1 compares the features of the module variants. Table 3-1. TI WiLink™ 8 Module Variants DEVICE FEATURE WL1835MOD WL1831MOD WL1805MOD WL1801MOD WLAN 2.4-GHZ SISO (1) √ √ √ √ (1) √ WLAN 2.4-GHZ MRC (1) √ BLUETOOTH √ WLAN 2.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 4 Terminal Configuration and Functions PIN 48 - GND PIN 47 - VBAT_IN PIN 45 - GND PIN 46 - VBAT_IN PIN 44 - GND PIN 43 - BT_UART_DBG PIN 42 - WL_UART_DBG PIN 41 - BT_EN PIN 40 - WLAN_EN PIN 39 - GND PIN 38 - VIO PIN 37 - GND PIN 36 - EXT_32K PIN 34 - GND PIN 35 - GND PIN 33 - GND Figure 4-1 shows the pin assignments for the 100-pin MOC package.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 4.1 www.ti.com Pin Attributes Table 4-1 describes the module pins. Table 4-1. Pin Attributes PIN NAME PIN NO. TYPE/ SHUTDOWN DIR STATE CONNECTIVITY (2) AFTER POWER UP (1) VOLTAGE LEVEL 1801 1805 1831 1835 Hi-Z 1.8 V v v v v WLAN SDIO clock. Must be driven by the host. – v v v v Input sleep clock: 32.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table 4-1. Pin Attributes (continued) PIN NAME WL_SDIO_D3_1V8 WL_IRQ_1V8 PIN NO. 13 14 TYPE/ SHUTDOWN DIR STATE I/O O Hi-Z PD RF_ANT2 18 ANA GPIO2 26 I/O PD GPIO1 27 I/O PD RF_ANT1 32 ANA WL_UART_DBG 42 O AFTER POWER UP (1) PU 0 VOLTAGE LEVEL 1.8 V 1.8 V CONNECTIVITY (2) 1801 v v 1805 v v 1831 v v 1835 DESCRIPTION (3) v WLAN SDIO data bit 3.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table 4-1. Pin Attributes (continued) PIN NAME PIN NO.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5 Specifications All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF antennas, unless otherwise indicated. NOTE For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os Application Report. Absolute Maximum Ratings (1) 5.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN Ambient operating temperature Maximum power dissipation 5.4 TYP MAX –20 UNIT 70 ºC WLAN operation 2.8 W Bluetooth operation 0.2 External Digital Slow Clock Requirements The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION MIN TYP MAX UNIT 2484 MHz RF_ANT1 pin 2.4-GHz SISO Operation frequency range 2412 –96.3 1 Mbps DSSS Sensitivity: 20-MHz bandwidth. At < 10% PER limit 2 Mbps DSSS –93.2 5.5 Mbps CCK –90.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 5.7 www.ti.com WLAN Performance: 2.4-GHz Transmitter Power over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION (1) MIN TYP MAX UNIT RF_ANT1 Pin 2.4-GHz SISO Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM (2) 1 Mbps DSSS 17.3 2 Mbps DSSS 17.3 5.5 Mbps CCK 17.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.8 WLAN Performance: Currents over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. SPECIFICATION TYP (AVG) –25°C Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49 2.4 GHz RX search SISO20 54 PARAMETER Receiver Transmitter 5.9 2.4-GHz RX search MIMO20 74 2.4-GHz RX search SISO40 59 2.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals (1) (continued) over operating free-air temperature range (unless otherwise noted) CONDITION PARAMETER MIN TYP MAX BR, co-channel EDR, co-channel EDR2 12 EDR3 20 –3.0 BR, adjacent ±1 MHz Bluetooth BR, EDR C/I performance Numbers show wanted signal-to-interfering-signal ratio.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.12 Bluetooth Performance: Modulation, BR (1) over operating free-air temperature range (unless otherwise noted) CONDITION (2) CHARACTERISTICS MIN BR –20-dB bandwidth BR modulation characteristics BR carrier frequency drift MAX UNIT 925 995 kHz 170 kHz ∆f1avg Mod data = 4 1s, 4 0s: 111100001111... 145 160 ∆f2max ≥ limit for at least 99.9% of all Δf2max Mod data = 1010101...
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals (1) (continued) over operating free-air temperature range (unless otherwise noted) CONDITION (2) PARAMETER MIN TYP low energy, co-channel Bluetooth low energy C/I performance. Note: Numbers show wanted signal-tointerfering-signal ratio. Smaller numbers indicate better C/I performance.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Bluetooth BR and EDR Dynamic Currents (continued) Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. USE CASE (1) (2) TYP UNIT 33.0 mA Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) 253.0 µA Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 332.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the enable signals. To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device (VBAT, VIO, and slow clock) are still stable and available.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.19.4 WLAN Power-Up Sequence Figure 5-4 shows the WLAN power-up sequence.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.19.6 WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses an SDIO interface and supports a maximum clock rate of 50 MHz.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.19.6.2 SDIO Switching Characteristics – High Rate Figure 5-8 and Figure 5-9 show the parameters for maximum clock frequency. tWH tWL VDD VIH Clock Input VIH VIL VSS VIL tTHL tTLH tISU VDD VIH Data Input VIH 50% VDD Not Valid tIH VIH Valid VIL VSS Not Valid VIL Figure 5-8.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN) The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface (HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and its host using HCI data packets ack as a shared transport for all functional blocks except WLAN.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Figure 5-10 shows the UART timing. Figure 5-10. UART Timing Diagram Table 5-5 lists the UART timing characteristics. Table 5-5. UART Timing Characteristics PARAMETER CONDITION MIN Baud rate MAX UNIT 37.5 4364 Kbps 1.5% Baud rate accuracy per byte Receive-transmit –2.5% Baud rate accuracy per bit Receive-transmit –12.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 5.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications Figure 5-12 shows the Bluetooth codec-PCM (audio) timing diagram. tW tW tCLK tis tih top Figure 5-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram Table 5-6 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6. Bluetooth Codec-PCM Master Timing Characteristics PARAMETER MIN MAX 162.76 (6.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 6 Detailed Description The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology. Figure 6-1 shows a high-level view of the WL1835MOD variant.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table 6-3. Shutdown and Sleep Currents PARAMETER Shutdown mode All functions shut down WLAN sleep mode Bluetooth sleep mode 6.1 POWER SUPPLY CURRENT TYP VBAT 10 VIO 2 VBAT 160 VIO 60 VBAT 110 VIO 60 UNIT µA µA µA WLAN Features The device supports the following WLAN features: • Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution • Baseband processor: IEEE Std 802.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 6.3 Bluetooth low energy Features The device supports the following Bluetooth low energy features: • Bluetooth 4.2 low energy dual-mode standard • All roles and role combinations, mandatory as well as optional • Up to 10 low energy connections • Independent low energy buffering allowing many multiple connections with no affect on BR-EDR performance 6.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 6.4.2 Innovation, Science, and Economic Development Canada (ISED) The WL18MODGB modules from TI are certified for IC as a single-modular transmitter. The WL18MODGB modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 6.5 Module Markings Figure 6-2 shows the markings for the TI WiLink 8 module. Model: WL18 MODGB Test Grade:&& FCC ID: Z64-WL18SBMOD IC: 451I-WL18SBMOD R 201-135370 LTC: XXXXXXX Figure 6-2. WiLink 8 Module Markings Table 6-5 describes the WiLink 8 module markings. Table 6-5. Description of WiLink™ 8 Module Markings MARKING DESCRIPTION WL18 MODGB Model && Test grade (for more information, see Section 6.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 6.7 www.ti.com End Product Labeling These modules are designed to comply with the FCC single modular FCC grant, Z64- WL18SBMOD. The host system using this module must display a visible label indicating the following text: Contains FCC ID: Z64-WL18SBMOD These modules are designed to comply with the IC single modular FCC grant, IC: 451I-WL18SBMOD.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 7 Applications, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com BT_EN WLAN/BT Enable Control. Connect to Host GPIO. WLAN_EN For Debug only VIO_IN OSC1 1V8 / 32.768kHz OSC-3.2X2.5 3 SLOW_CLK C1 1uF 0402 GND WL_RS232_TX_1V8 26 WL_RS232_RX_1V8 25 TP6 21 TP7 G7 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 B1 B2 C10 NU_0.3pF 0402 components ANT2- WL_2.4_IO1 C6 10pF 0402 C14 4pF 0402 ANT2 ANT016008LCD2442MA1 ANT-N3-1.6X0.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table 7-1 lists the bill materials (BOM). Table 7-1. BOM ITEM DESCRIPTION PART NUMBER PACKAGE REF. QTY MFR 1 TI WL1835 Wi-Fi / Bluetooth module WL1835MODGI 13.4 x 13.3 x 2.0 mm U1 1 TI 2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 3.2 x 2.5 x 1.0 mm OSC1 1 TXC 3 Antenna / chip / 2.4 and 5 GHz / peak gain > 5 dBi ANT016008LCD2442MA1 1.6 mm x 0.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Table 7-2. Layout Recommendations Summary (continued) DESCRIPTION ITEM Supply and Interface 14 The power trace for VBAT must be at least 40-mil wide. 15 The 1.8-V trace must be at least 18-mil wide. 16 Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. 17 If possible, shield VBAT traces with ground above, below, and beside the traces.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 7.1.4 Module Layout Recommendations Figure 7-3 shows layer 1 and layer 2 of the TI module layout. Layer 1 Layer 2 (Solid GND) Figure 7-3. TI Module Layout Follow these module layout recommendations: • Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. • Do not run signal traces underneath the module on a layer where the module is mounted.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Module COM8 Board Figure 7-4. Block of Ground Pads on Bottom Side of Package Figure 7-5 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads. Figure 7-5.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 7.1.6 Baking and SMT Recommendations 7.1.6.1 Baking Recommendations Follow these baking guidelines for the WiLink 8 module: • Follow MSL level 3 to perform the baking process. • After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 8 Device and Documentation Support 8.1 Device Support 8.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 8.1.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDCWL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x).
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML (TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 8.2 Related Links Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links 8.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 9 Mechanical, Packaging, and Orderable Information 9.1 TI Module Mechanical Outline Figure 9-1 shows the mechanical outline for the device. W e4 T e5 W e2 d2 e3 d1 e1 L L e6 Pin 2 Indicator a3 b1 b2 c2 c3 4 3 2 a1 a2 b3 1 c1 Bo tto m Vi e w Si d e Vi e w To p Vi e w Figure 9-1. TI Module Mechanical Outline Table 9-1 lists the dimensions for the mechanical outline of the device.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 9.2 Tape and Reel Information Emboss taping specification for MOC 100 pin. 9.2.1 Tape and Reel Specification P2 Do F E Po W Pin 1 T P C0.5 Ko 5.00° Ao = Bo Figure 9-2. Tape Specification Table 9-2. Dimensions for Tape Specification ITEM W E F P Po P2 Do T Ao Bo Ko DIMENSION (mm) 24.00 (±0.30) 1.75 (±0.10) 11.50 (±0.10) 20.00 (±0.10) 4.00 (±0.10) 2.00 (±0.10) 2.00 (±0.10) 0.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 9.2.2 Packing Specification 9.2.2.1 Reel Box The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 9-4. 856 45 370 572 360 Figure 9-4. Reel Box The reel box is made of corrugated fiberboard. 9.2.2.2 Shipping Box Figure 9-5 shows a typical shipping box.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com 9.3 Packaging Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.
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WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.
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PACKAGE OUTLINE MOC0100A QFM - 2.0 mm max height QUAD FLAT MODULE 13.4 13.2 B A 1 PIN 1 INDEX AREA 13.5 13.3 C 2 MAX 0.08 C 2X 11.95 2X 9.8 7.7 TYP 17 33 G36 G6 7.7 TYP (1.4) TYP 2X 9.8 G3 0.7 2X 12.05 G1 1 PIN 2 ID 56X 0.7 4X 0.8 0.7 36X G7 G19 64 1.05 0.95 60X 0.45 0.35 0.1 0.05 G31 C A B C 49 SYMM (1.4) TYP 4221006/B 10/2016 NOTES: 1. 2. 3. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only.
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EXAMPLE BOARD LAYOUT MOC0100A QFM - 2.0 mm max height QUAD FLAT MODULE 2X (11.95) 1 64 49 G1 G7 G19 G13 G25 G31 2X (12.05) SYMM 56X (0.7) (1.05) TYP (1.4) TYP 60X (0.75) G6 G12 G18 G24 G30 60X (0.4) G36 (1.4) TYP (1.05) TYP 33 17 4X (0.75) 36X (1) SYMM LAND PATTERN EXAMPLE SCALE: 8X 0.05 MIN ALL AROUND SOLDER MASK DETAILS SOLDER MASK OPENING SOLDER MASK DEFINED (R0.05) TYP METAL UNDER SOLDER MASK 4221006/B 10/2016 NOTES: (continued) 4. 5. 6.
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www.ti.
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EXAMPLE STENCIL DESIGN MOC0100A QFM - 2.0 mm max height QUAD FLAT MODULE 2X (11.95) 64 1 49 G1 G7 G19 G13 G25 G31 60X (0.4) 60X (0.75) 2X (12.05) SYMM 56X (0.7) (1.05) TYP (1.4) TYP SEE DETAIL B G6 G12 G18 (1.05) TYP G24 G30 G36 (1.4) TYP 33 17 SYMM SEE DETAIL A SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PADS 1, 17, 33, 49, G1-G36 90% PRINTED COVERAGE BY AREA SCALE: 8X SOLDER PASTE METAL UNDER SOLDER MASK METAL UNDER SOLDER MASK 4X (0.
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IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.