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Layout Guidelines

Figure 11. Module Layout Guidelines (Top Layer)

Figure 12. Module Layout Guidelines (Bottom Layer)

Table 3 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12.

Table 3. Module Layout Guidelines

Reference Guideline Description

1 Keep the proximity of ground vias close to the pad.

2 Do not run signal traces underneath the module on the layer where the module is mounted.

3 Have a complete ground pour in layer 2 for thermal dissipation.

4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.

5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible.

6 Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.

SWRU382–November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth

Module Evaluation Board for

TI Sitara™ Platform

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