User's Manual

Circuit Design

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5.2 Bill of Materials (BOM)

Table 2 lists the BOM for the EVB.

Table 2. BOM

Item Description Part Number Package Reference Qty Mfr

1 TI WL1837 Wi-Fi / Bluetooth WL1837MODGI 13.4 mm x 13.3 mm U1 1 Jorjin

module x 2.0 mm

2 XOSC 3225 / 32.768KHZ / 1.8 V / 7XZ3200005 3.2 mm × 2.5 mm × OSC1 1 TXC

±50 ppm 1.0 mm

3 Antenna / Chip / 2.4 and 5 GHz W3006 10.0 mm × 3.2 mm ANT1, ANT2 2 Pulse

× 1.5 mm

4 Mini RF header receptacle U.FL-R-SMT-1(10) 3.0 mm × 2.6 mm × J5, J6 2 Hirose

1.25 mm

5 Inductor 0402 / 1.3 nH / ±0.1 nH / LQP15MN1N3B02 0402 L1 1 Murata

SMD

6 Inductor 0402 / 1.8 nH / ±0.1 nH / LQP15MN1N8B02 0402 L3 1 Murata

SMD

7 Inductor 0402 / 2.2 nH / ±0.1 nH / LQP15MN2N2B02 0402 L4 1 Murata

SMD

8 Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01 0402 C13 1 Murata

/ ±0.1 pF

9 Capacitor 0402 / 2.4 pF / 50 V / GJM1555C1H2R4BB01 0402 C14 1 Murata

C0G / ±0.1 pF

10 Capacitor 0402 / 0.1 µF / 10 V / 0402B104K100CT 0402 C3, C4 2 Walsin

X7R / ±10%

11 Capacitor 0402 / 1 µF / 6.3 V / GRM155R60J105KE19D 0402 C1 1 Murata

X5R / ±10% / HF

12 Capacitor 0603 / 10 µF / 6.3 V / C1608X5R0J106M 0603 C2 1 TDK

X5R / ±20%

13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1 to R4, R6 to 31 Walsin

R19, R21 to

R30, R33, C5,

(1)

14 Resistor 0402 / 10K / ±5% WR04X103 JTL 0402 R20 1 Walsin

15 Resistor 0603 / 0R / ±5% WR06X000 PTL 0603 R31, R32 2 Walsin

16 PCB WG7837TEC8B D02 / Layer 76.0 mm × 31.0 mm 1 茂榮

4 / FR4 (4 pcs / PNL) × 1.6 mm

(1)

C5 and C6 are mounted with a 0-Ω resistor by default.

WL1837MODCOM8I WLAN MIMO and Bluetooth

Module Evaluation Board SWRU382–November 2014

for TI Sitara™ Platform

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