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Circuit Design

6.2 Bill of Materials (BOM)

Table 1 lists the bill of materials.

Table 1. BOM

1 TI WL1835 WiFi/Bluetooth Module WL18MODGB U1

2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 OSC1

3 ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi ANT016008LCD2442MA1 ANT1, ANT2

4 CON Male 1x2 / Pitch P301-SGP-040/028-02 J1, J3, J4

5 DC JUMPER / PITCH 2.0 mm CMJ-20BB J1, J3

6 Mini RF Header Receptacle U.FL-R-SMT-1(10) J5, J6

7 IND 0402 / 1.1 nH / ±0.05 nH / SMD LQP15MN1N1W02 L1

8 IND 0402 / 1.5 nH / ±0.05 nH / SMD LQP15MN1N5W02 L2

9 CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R2BB01 C11

10 CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H2R2BB01 C9

11 CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H4R0BB01 C14

12 CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF GJM1555C1H8R0BB01 C13

13 CAP 0402 / 10 pF / 50 V / NPO / ±5% 0402N100J500LT C7, C8

14 CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10% 0402B104K100CT C3, C4

15 CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF GRM155R60J105KE19D C1

16 CAP 0603 / 10 µF / 6.3 V / X5R / ±20% C1608X5R0J106M C2

R1, R2, R3, R4, R5, R6, R7, R8, R9,

R10, R11, R12, R13, R14, R15,

17 RES 0402 / 0R / ±5% WR04X000 PTL R16, R17, R18, R19, R21, R22,

R23, R24, R25, R26, R27, R28,

R29, R30, R31, R32

18 RES 0402 / 10K / ±5% WR04X103 JTL R20

SWRU359C–September 2013–Revised January 2014 WL1835MODCOM8B WLAN MIMO and Bluetooth

Module Evaluation Board

for TI Sitara™ Platform

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